STMicroelectronics Unveils New Pressure Sensor Technology

STMicroelectronics Unveils New Pressure Sensor Technology 
Fully Molded Package Incorporating an Isolated Sensing Element Offers
Industry-Leading Precision for Absolute Pressure Measurement 
GENEVA -- (Marketwired) -- 07/30/13 --   STMicroelectronics (NYSE:
STM), a global semiconductor leader serving customers across the
spectrum of electronics applications, the world's top MEMS
(Micro-Electro-Mechanical Systems) manufacturer, and the leading
supplier of MEMS sensors for consumer and portable applications(1),
has announced a new, ST-patented technology that isolates the
pressure-sensing element within a fully molded package to meet the
ultra-small form factor requirements and design creativity for the
next generation of portable consumer devices. 
Integrating the isolated pressure-sensing element in a fully molded
package, this unique technology enables fully encapsulated wire
bonding with zero risk of corrosion, elimination of wire bonding
damage during pick and place assembly, zero risk of cap detachment or
cap damage while the device is being mounted, and no impact on the
sensor from the soldering process to ensure a more robust packaging
solution. 
According to market analysts Yole Developpement(2), the MEMS pressure
sensor market will grow from $1.9B in 2012 to $3B in 2018. MEMS
pressure sensors for consumer applications, especially for
smartphones and tablets, will represent 1.7 billion units and will
overtake automotive as the leading target application for MEMS,
adding 8% CAGR to the global MEMS pressure sensor market. ST has over
800 MEMS-related patents and patent applications worldwide and as the
world's top MEMS manufacturer, has a production capacity of 4 million
devices per day and has shipped more than three billion MEMS devices. 
"This technology represents a revolution in the enhancement of
performance and quality for pressure sensors. STMicroelectronics
pioneered the use of fully molded packages without gel for high
volume manufacturing for Accelerometers and Gyroscopes," said
Benedetto Vigna, Executive Vice President, General Manager, Analog,
MEMS & Sensors Group, STMicroelectronics. "We are now leveraging this
knowledge to revolutionize the packaging in the emerging field of
pressure sensors where STMicroelectronics is the first to use a fully
molded package without gel for a high performance pressure sensor
with enhanced accuracy." 
The new technology enhances accuracy (+/- 0.2 mbar) while continuing
to offer zero drift, low noise (0.010 mbar RMS) and a simplified
calibration system, making it ideal for a broad range of consumer,
automotive and industrial applications including indoor/outdoor
navigation, location-based services, enhanced GPS dead-reckoning,
altimeter and barometer functions, weather station equipment, and
healthcare applications.  
About STMicroelectronics
 ST is a global leader in the semiconductor
market serving customers across the spectrum of sense and power and
automotive products and embedded processing solutions. From energy
management and savings to trust and data security, from healthcare
and wellness to smart consumer devices, in the home, car and office,
at work and at play, ST is found everywhere microelectronics make a
positive and innovative contribution to people's life. By getting
more from technology to get more from life, ST stands for
life.augmented. 
In 2012, the Company's net revenues were $8.49 billion. Further
information on ST can be found at www.st.com. 
(1) IHS: MEMS H2 2012 Special Report
 (2) Yole Developpement: MEMS
Pressure Sensor 2013 
STMicroelectronics Pressure Sensor Technology:
http://hugin.info/152740/R/1719700/572373.pdf  
For Press Information Contact:
STMicroelectronics
Michael Markowitz
Director Technical Media Relations
+1 781 591 0354
michael.markowitz@st.com 
 
 
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