Rudolph Announces New Metrology Suite for Advanced Packaging

  Rudolph Announces New Metrology Suite for Advanced Packaging

   New NSX Metrology Series includes application-specific configurations to
address unique metrology requirements for wafer level packaging, 2.5D and 3DIC

Business Wire

FLANDERS, N.J. -- July 24, 2013

Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process
characterization, photolithography equipment and software for the
semiconductor, FPD, LED and solar industries, today released three new
application-specific configurations of its industry-leading NSX^® 320
Automated Macro Defect Inspection System. The suite includes
specially-designed configurations for wafer level packaging, 2.5D (interposer)
and 3DICs using through-silicon via (TSV) as interconnects. The first NSX 320
Metrology System for wafer level packaging shipped in June to a major
outsourced assembly and test (OSAT) facility in Asia.

“These new application-specific configurations of our established NSX 320
System are designed to address the emerging need for fast, precise
three-dimensional (3D) measurements in the rapidly growing advanced packaging
market sector,” said Rajiv Roy, vice president of business development and
director of back-end marketing at Rudolph Technologies. “We have completed the
integration of 3D measurement sensors, recently acquired from Tamar
Technology, into the NSX System. Tamar’s sensor technology is well recognized
and widely used, and integrating it into the NSX 320 System adds critical
capability required for enabling advanced packaging applications such as
copper pillar bumping and TSV.”

The NSX 320 wafer level packaging configuration is designed to measure film
thickness (polymers, photoresist, glass), thin remaining silicon thickness
(RST), surface topography, copper pillar height and solder bump height. The
advanced wafer level packaging configuration adds measurements of the wafer
profile (warp and bow), total stack thickness and thick/thin RST (bonded wafer
before and after grind). The 3DIC configuration is capable of all the above
measurements plus via depth, trench depth, bonded wafer TTV and adhesive

Roy stated, “3DIC device volume is forecasted to grow to $38.4B by 2017,
according to YoleDéveloppement. Rudolph is positioned to address the growth
requirements for wafer level packaging, as well as 2.5D and other advanced
packaging technologies, with industry-proven metrology tools that offer
superior speed and measurement solutions.”

For more information about Rudolph’s NSX 320 Metrology Series, visit

About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development,
manufacture and support of defect inspection, advanced packaging lithography,
process control metrology, and data analysis systems and software used by
semiconductor device manufacturers worldwide. Rudolph provides a full-fab
solution through its families of proprietary products that provide critical
yield-enhancing information, enabling microelectronic device manufacturers to
drive down the costs and time to market of their products. The Company’s
expanding portfolio of equipment and software solutions is used in both the
wafer processing and final manufacturing of ICs, and in adjacent markets such
as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports
its customers with a worldwide sales and service organization. Additional
information can be found on the Company’s website at

Safe Harbor Statement
This press release contains forward-looking statements within the meaning of
the Private Securities Litigation Reform Act of 1995 (the “Act”) which include
the benefits to customers of Rudolph’s products, Rudolph’s existing market
position and its ability to maintain and advance such position relative to its
competitors and Rudolph’s ability to meet the expectations and needs of our
customers as well as other matters that are not purely historical data.
Rudolph wishes to take advantage of the “safe harbor” provided for by the Act
and cautions that actual results may differ materially from those projected as
a result of various factors, including risks and uncertainties, many of which
are beyond Rudolph’s control. Such factors include, but are not limited to,
delays in shipping products for technical performance, component supply or
other reasons, the company’s ability to leverage its resources to improve its
positions in its core markets and fluctuations in customer capital spending.
Additional information and considerations regarding the risks faced by Rudolph
are available in Rudolph’s Form 10-K report for the year ended December 31,
2012 and other filings with the Securities and Exchange Commission. As the
forward-looking statements are based on Rudolph’s current expectations, the
company cannot guarantee any related future results, levels of activity,
performance or achievements. Rudolph does not assume any obligation to update
the forward-looking information contained in this press release.


Rudolph Technologies, Inc.
Steven R. Roth, 973-448-4302
Trade Press:
Amy Pauling, 952-259-1794
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