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STMicroelectronics : "Nano2017" R&D Program Announced at STMicroelectronics' Crolles Site



 STMicroelectronics : "Nano2017" R&D Program Announced at STMicroelectronics'
                                 Crolles Site

  Five-year strategic R&D program led by ST to further advance the company's
       leadership in key embedded processing solutions and technologies

                                       

Crolles, France,  July 22,  2013 -  STMicroelectronics (NYSE:  STM), a  global 
semiconductor leader  serving customers  across  the spectrum  of  electronics 
applications,  has  announced  today  that  French  Prime  Minister  Jean-Marc 
Ayrault, along  with  Minister for  Industry  Arnaud Montebourg,  Minister  of 
Higher Education and Research Genevieve Fioraso, and Fleur Pellerin,  Minister 
Delegate attached to the Minister for Industry, with responsibility for  Small 
and Medium-sized Enterprises, Innovation and  the Digital Economy, as well  as 
representatives from  national, regional  and local  authorities and  managers 
from ST met today at ST's site at Crolles, near Grenoble, France, to celebrate
the Nano2017 Research and  Development program. Also  present at the  ceremony 
were key partners of  ST for the Nano2017  R&D program including CEA-Leti  and 
IBM.

Nano2017 is a five-year public-private strategic R&D program, led by ST, which
gathers  many  players,  including  the  leading  French  research  laboratory 
CEA-LETI -a historical partner of the ST  Crolles R&D center since its set  up 
in  1992-,  several   University  research  teams,   material  and   equipment 
manufacturers, vendors  and  CAD  intellectual  property  specialists,  system 
integrators, and other European stakeholders and Small and Medium  Enterprises 
(SMEs). The  project  is supported  by  French national,  regional  and  local 
authorities as  well as  by the  European community  through the  ENIAC  Joint 
Technology Initiative (JTI). Funding for the program is subject to approval by
the European Commission. 

Nano2017    strengthens     ST's    leadership     in    key     technologies: 
FD-SOI^[1] (low-power, high-performance  processing), next-generation  imaging 
(sensors and  image  signal  processors)  ^[2]  and  next-generation  embedded 
non-volatile memories  ^[3].  These  technologies  are at  the  core  of  ST's 
embedded  processing   solutions  which   include  microcontrollers,   imaging 
solutions, digital  consumer  products,  application  processors  and  digital 
ASICs. Embedded processing technologies and  products are developed mainly  in 
the French  sites  of Crolles,  Grenoble,  Rousset and  Sophia  Antipolis.  ST 
currently addresses an estimated $67 billion market ^[4] in 2013 for  embedded 
processing solutions and  has significant  potential to grow  and gain  market 
share.

About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the
spectrum of sense and power and automotive products and embedded processing
solutions. From energy management and savings to trust and data security, from
healthcare and wellness to smart consumer devices, in the home, car and
office, at work and at play, ST is found everywhere microelectronics make a
positive and innovative contribution to people's life. By getting more from
technology to get more from life, ST stands for life.augmented.

In 2012, the Company's net revenues were $8.49 billion. Further information on
ST can be found at www.st.com

For further information, please contact:

INVESTOR RELATIONS:
Tait Sorensen                                     
Group VP, Investor Relations
Tel: +1 602 485 2064
tait.sorensen@st.com

MEDIA RELATIONS:
Nelly Dimey                                       
Director, Corporate Media and Public Relations
Tel: +33 1 58 07 77 85
nelly.dimey@st.com

-------------------------

[1] FD-SOI (Fully Depleted-Silicon on Insulator) is a next-generation  process 
technology that  addresses most  of  the challenges  caused by  continuing  to 
shrink the features of transistors to  dimensions measured in the 10s or  100s 
of  atoms.  Because  of  leakage,   current  silicon  process  technology   is 
increasingly inefficient at  28nm and below.  FD-SOI is a  faster, cooler  and 
simpler alternative.

[2] Developments in imaging sensors  and image signal processing are  expected 
to  enable  extraordinary  applications  that  see,  for  energy   efficiency, 
security, convenience and health. Imagine TV screens that power down when  you 
look away, vehicles  and residences  that recognize their  owners and  medical 
equipment that  recognize unusual  growth.  These will  all be  possible  with 
advances in imaging.

[3] An Embedded Non-Volatile Memory (eNVM) is an important component of almost
all systems-on-chips. The eNVM operates as an on-chip program or data  storage 
locker, where the system can safely store firmware, security-code, calibration
data, and other application-critical information-even  when the system is  not 
being powered.

[4] Source: WSTS 

ST Nano 2017 PR

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(ii) they are solely responsible for the content, accuracy and originality of
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Source: STMicroelectronics via Thomson Reuters ONE
HUG#1717863
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