Breaking News

World Health Organization Declares Nigeria Ebola-Free
Tweet TWEET

USHIO Has Booked Its 2.5D/3D Interposer Stepper UX7-3Di LIS 350 and Will Deliver the First Unit to a Leading Advanced-Packaging

  USHIO Has Booked Its 2.5D/3D Interposer Stepper UX7-3Di LIS 350 and Will
  Deliver the First Unit to a Leading Advanced-Packaging Manufacturer by the
  End of July

SEMICON West 2013

Business Wire

TOKYO -- July 7, 2013

USHIO INC., (TOKYO: 6925) (President and CEO: Shiro Sugata) today announced
that the company has booked the large-field stepper “UX7-3Di LIS 350” for
manufacturing interposers used for 2.5D/3D packaging applications, and will
deliver the first unit to a leading advanced-packaging manufacturer by the end
of this month.

UX7-3Di LIS 350: 2.5D/3D Interposer Stepper (Photo: Business Wire)

UX7-3Di LIS 350: 2.5D/3D Interposer Stepper (Photo: Business Wire)

The UX7-3Di LIS 350, the latest model of the UX7-3Di interposer stepper
series, has achieved an industry-leading resolution of 2 µm L/S on a 300-mm Si
wafer as well as an organic substrate. Mounted with a proprietary alignment
mechanism, the UX7-3Di LIS 350 is able to address a warp or
expansion/contraction of an organic substrate, thus being optimized for
manufacturing 2.5D/3D interposers made of organic substrates that have
recently become popular, other than Si wafers.

“For high-volume production of 2.5D/3D interposers, we have introduced a
stepper capable of processing not only Si wafers but also square substrates
including glass and organic substrates. Utilizing this UX7-3Di LIS 350 stepper
allows significant reduction of the interposer manufacturing cost, which
ultimately leads to reduction of the manufacturing cost of final products such
as smart phones and tablet PCs,” commented Masayuki Itaba, General Manager of
the Exposure Business Unit, USHIO INC.

In order to meet the further need for finer circuit patterns, USHIO is
currently developing a large-field precision projection lens that can produce
a super-high resolution of 1 µm L/S.

Under the slogan “Advanced Packaging Solutions”, USHIO will exhibit a series
of its lithography systems for advanced packaging applications, including the
UX7-3Di LIS 350 stepper, through a panel display at SEMICON West 2013, to be
held on July 9 through July 11 at Moscone Center in San Francisco, California
(Booth # 2241).

About USHIO INC.

Established in 1964, USHIO INC. (TOKYO: 6925) is a leading manufacturer of
light sources such as lamps, lasers, and LEDs, in a broad range from
ultraviolet to visible to infrared rays, as well as optical equipment and
cinema-related products that incorporate these light sources. It also makes
products in the electronics field, such as semiconductors, flat panel displays
and electronic components, and in the visual imaging field, including digital
projectors and lighting. Many of these products enjoy dominant market shares.
In recent years, USHIO has undertaken business in the life science area, such
as the medical and the environmental fields. See http://www.ushio.co.jp/en/.

The product data sheet for USHIO’s UX Series can be downloaded from:
www.ushio.co.jp/semiconwest2013

©2013 USHIO INC.

Photos/Multimedia Gallery Available:
http://www.businesswire.com/multimedia/home/20130707005001/en/

Multimedia
Available:http://www.businesswire.com/cgi-bin/mmg.cgi?eid=50665143&lang=en

Contact:

USHIO INC.
IR & Public Relations
Tel: +81-3-3242-1815
Fax: +81-3-3245-0589
contact@ushio.co.jp
or
USHIO AMERICA, INC.
Toru Fujinami, +1-714-229-3165
Fax: +1-714-229-7165
tfujinami@ushio.com
 
Press spacebar to pause and continue. Press esc to stop.