USHIO Has Booked Its 2.5D/3D Interposer Stepper UX7-3Di LIS 350 and Will Deliver the First Unit to a Leading Advanced-Packaging Manufacturer by the End of July SEMICON West 2013 Business Wire TOKYO -- July 7, 2013 USHIO INC., (TOKYO: 6925) (President and CEO: Shiro Sugata) today announced that the company has booked the large-field stepper “UX7-3Di LIS 350” for manufacturing interposers used for 2.5D/3D packaging applications, and will deliver the first unit to a leading advanced-packaging manufacturer by the end of this month. UX7-3Di LIS 350: 2.5D/3D Interposer Stepper (Photo: Business Wire) UX7-3Di LIS 350: 2.5D/3D Interposer Stepper (Photo: Business Wire) The UX7-3Di LIS 350, the latest model of the UX7-3Di interposer stepper series, has achieved an industry-leading resolution of 2 µm L/S on a 300-mm Si wafer as well as an organic substrate. Mounted with a proprietary alignment mechanism, the UX7-3Di LIS 350 is able to address a warp or expansion/contraction of an organic substrate, thus being optimized for manufacturing 2.5D/3D interposers made of organic substrates that have recently become popular, other than Si wafers. “For high-volume production of 2.5D/3D interposers, we have introduced a stepper capable of processing not only Si wafers but also square substrates including glass and organic substrates. Utilizing this UX7-3Di LIS 350 stepper allows significant reduction of the interposer manufacturing cost, which ultimately leads to reduction of the manufacturing cost of final products such as smart phones and tablet PCs,” commented Masayuki Itaba, General Manager of the Exposure Business Unit, USHIO INC. In order to meet the further need for finer circuit patterns, USHIO is currently developing a large-field precision projection lens that can produce a super-high resolution of 1 µm L/S. Under the slogan “Advanced Packaging Solutions”, USHIO will exhibit a series of its lithography systems for advanced packaging applications, including the UX7-3Di LIS 350 stepper, through a panel display at SEMICON West 2013, to be held on July 9 through July 11 at Moscone Center in San Francisco, California (Booth # 2241). About USHIO INC. Established in 1964, USHIO INC. (TOKYO: 6925) is a leading manufacturer of light sources such as lamps, lasers, and LEDs, in a broad range from ultraviolet to visible to infrared rays, as well as optical equipment and cinema-related products that incorporate these light sources. It also makes products in the electronics field, such as semiconductors, flat panel displays and electronic components, and in the visual imaging field, including digital projectors and lighting. Many of these products enjoy dominant market shares. In recent years, USHIO has undertaken business in the life science area, such as the medical and the environmental fields. See http://www.ushio.co.jp/en/. The product data sheet for USHIO’s UX Series can be downloaded from: www.ushio.co.jp/semiconwest2013 ©2013 USHIO INC. Photos/Multimedia Gallery Available: http://www.businesswire.com/multimedia/home/20130707005001/en/ Multimedia Available:http://www.businesswire.com/cgi-bin/mmg.cgi?eid=50665143&lang=en Contact: USHIO INC. IR & Public Relations Tel: +81-3-3242-1815 Fax: +81-3-3245-0589 firstname.lastname@example.org or USHIO AMERICA, INC. Toru Fujinami, +1-714-229-3165 Fax: +1-714-229-7165 email@example.com
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USHIO Has Booked Its 2.5D/3D Interposer Stepper UX7-3Di LIS 350 and Will Deliver the First Unit to a Leading Advanced-Packaging
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