STATS ChipPAC Celebrates 1,000th U.S. Patent Milestone

STATS ChipPAC Celebrates 1,000th U.S. Patent Milestone 
Commitment to Innovation and Strong Focus on Advanced Wafer Level
Technology Deliver Broad Portfolio of Intellectual Property 
SINGAPORE -- 02 JULY 2013, UNITED STATES -- (Marketwired) -- 07/01/13
--  STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST:
STATSChP) (SGX: S24), a leading provider of advanced semiconductor
packaging and test services, today announced that it has been granted
its 1,000th patent by the U.S. Patent and Trademark Office (USPTO).  
Since the inception of its Intellectual Property (IP) program in
2000, STATS ChipPAC has filed more than 1,500 patents and published
patent applications with the USPTO and more than 900 patents and
applications in other countries, of which more than 200 have been
registered or allowed as patents in Singapore, South Korea, Taiwan
and other countries. This is at least 400 more U.S. patents and
applications than other companies in the global Outsourced
Semiconductor Assembly and Test (OSAT) industry. STATS ChipPAC has
concentrated its IP development on advanced or future technologies
such as wafer level packaging, Post Wafer fab Processing (PWfP) or
mid-end processing, Through Silicon Via (TSV), flip chip
interconnect, integrated passive devices (IPD) and 2.5D/3D package
integration. With this strategic focus, STATS ChipPAC has built up a
patent portfolio in which advanced or future technologies comprise
60% of its IP.  
STATS ChipPAC's patent portfolio has been recognized for its quality,
strength and overall importance to the semiconductor manufacturing
industry by The Institute of Electrical and Electronics Engineers
(IEEE), the world's largest professional association for the
advancement of technology. IEEE ranked STATS ChipPAC among the top 10
semiconductor manufacturing companies in the world for the last two
consecutive years based on the strength of its IP and technology
innovations.  
"Our 1,000th U.S. patent is a milestone achievement for STATS
ChipPAC. Over the last 5 to 10 years, we have demonstrated our
commitment to technology innovation and built a high-quality,
innovative IP portfolio. In 2011, we became the leading patent holder
among our competitors worldwide in terms of the number of U.S.
patents granted and have continued to develop advanced technology and
process improvements that will drive evolutionary packaging for our
customers," said Dr. Han Byung Joon, Executive Vice President and
Chief Technology Officer, STATS ChipPAC. 
STATS ChipPAC's 1,000th U.S. patent is a strong representation of the
priority the Company has placed on the development of advanced wafer
level technology. U.S. Patent No. 8,456,002, "Semiconductor Device
and Method of Forming Insulating Layer Disposed Over the
Semiconductor Die for Stress Relief", relates to innovations in the
assembly of embedded Wafer Level Ball Grid Array (eWLB) devices in
which an insulating layer provides stress relief during the formation
of an interconnect structure in the device. This is part of a family
of patents that includes five previously granted U.S. patents for
eWLB and Wafer Level Chip Scale Packaging (WLCSP) inventions.  
Dr. Han continued, "This milestone patent is further recognition not
only of our rapidly evolving wafer level technologies, but also of
our dedication and leadership in developing innovative technologies
that provide solutions for the challenges confronting semiconductor
packaging today." 
Forward-Looking Statements
 Certain statements in this release are
forward-looking statements that involve a number of risks and
uncertainties that could cause actual results to differ materially
from those described in this release. Factors that could cause actual
results to differ include, but are not limited to, general business
and economic conditions and the state of the semiconductor industry;
prevailing market conditions; demand for end-use applications
products such as communications equipment, consumer and
multi-applications and personal computers; decisions by customers to
discontinue outsourcing of test and packaging services; level of
competition; our reliance on a small group of principal customers;
our continued success in technological innovations; pricing
pressures, including declines in average selling prices; intellectual
property rights disputes and litigation; our ability to control
operating expenses; our substantial level of indebtedness and access
to credit markets; potential impairment charges; availability of
financing; changes in our product mix; our capacity utilisation;
delays in acquiring or installing new equipment; limitations imposed
by our financing arrangements which may limit our ability to maintain
and grow our business; returns from research and development
investments; changes in customer order patterns; customer credit
risks; disruption of our operations; shortages in supply of key
components and disruption in supply chain; the amount of the business
interruption insurance claim due to flooding of the Thailand Plant;
loss of key management or other personnel; defects or malfunctions in
our testing equipment or packages; rescheduling or cancelling of
customer orders; adverse tax and other financial consequences if the
taxing authorities do not agree with our interpretation of the
applicable tax laws; classification of our Company as a passive
foreign investment company; our ability to develop and protect our
intellectual property; changes in environmental laws and regulations;
exchange rate fluctuations; regulatory approvals for further
investments in our subsidiaries; majority ownership by Temasek
Holdings (Private) Limited ("Temasek") that may result in conflicting
interests with Temasek and our affiliates; unsuccessful acquisitions
and investments in other companies and businesses; labour union
problems in South Korea; uncertainties of conducting business in
China and changes in laws, currency policy and political instability
in other countries in Asia; natural calamities and disasters,
including outbreaks of epidemics and communicable diseases; the
continued trading and listing of our ordinary shares on the Singapore
Exchange Securities Trading Limited ("SGX-ST"). You should not unduly
rely on such statements. We do not intend, and do not assume any
obligation, to update any forward-looking statements to reflect
subsequent events or circumstances. 
About STATS ChipPAC Ltd. 
 STATS ChipPAC Ltd. (SGX-ST Code: S24) is a
leading service provider of semiconductor packaging design, assembly,
test and distribution solutions in diverse end market applications
including communications, digital consumer and computing. With global
headquarters in Singapore, STATS ChipPAC has design, research and
development, manufacturing or customer support offices throughout
Asia, the United States and Europe. STATS ChipPAC is listed on the
SGX-ST. Further information is available at www.statschippac.com.
Information contained in this website does not constitute a part of
this release.  
Investor Relations Contact:
Tham Kah Locke
Vice President of Corporate Finance 
Tel: (65) 6824 7788
Fax: (65) 6720 7826
email: kahlocke.tham@statschippac.com 
Media Contact:
Lisa Lavin
Deputy Director of Marketing Communications
Tel: (208) 867-9859
email: lisa.lavin@statschippac.com 
 
 
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