Development Efforts and Architectural Enhancements: Long-term Investments on Robust Technologies - Research Report on Texas

 Development Efforts and Architectural Enhancements: Long-term Investments on
Robust Technologies - Research Report on Texas Instruments, Mellanox, Vishay,
                   Cavium, and Integrated Device Technology

Editor Note: For more information about this release, please scroll to bottom.

PR Newswire

NEW YORK, June 28, 2013

NEW YORK, June 28, 2013 /PRNewswire/ --

Today, Wall Street Reports announced new research reports highlighting Texas
Instruments Inc. (NASDAQ: TXN), Mellanox Technologies, Ltd. (NASDAQ: MLNX),
Vishay Intertechnology Inc. (NYSE: VSH), Cavium, Inc. (NASDAQ: CAVM), and
Integrated Device Technology, Inc. (NASDAQ: IDTI). Today's readers may access
these reports free of charge - including full price targets, industry analysis
and analyst ratings - via the links below.

Texas Instruments Inc. Research Report

On June 7, 2013, Texas Instruments Inc. (TI) outlined its long-term strategy
for manufacturing facilities in Chengdu, China. The Company's future plans
include a new assembly/test operation and the expansion of its existing wafer
fabrication factory. TI reported that its investments in these operations
could total up to $1.7 billion over the next 15 years and potentially include
facilities, manufacturing equipment and land. "The Chengdu Hi-Tech Zone has
been an excellent location for TI's manufacturing investments in China. We
believe this region offers significant benefits to TI and the more than
100,000 customers we serve," said Kevin Ritchie, Senior Vice President of TI's
Technology & Manufacturing Group. According to TI, this investment plan does
not change its 2013 capital spending forecast, and hence the Company continues
to expect capital spending levels to remain at about 4% of revenue. The
Company also said that if revenue exceeds $18 billion, the capital spending
levels would then range between 4% and 7% of revenue over the long term. The
Full Research Report on Texas Instruments Inc. - including full detailed
breakdown, analyst ratings and price targets - is available to download free
of charge at: [http://www.wsreports.com/r/full_research_report/ce50_TXN]

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Mellanox Technologies, Ltd. Research Report

On June 18, 2013, Mellanox Technologies, Ltd. (Mellanox) announced that the
Company continued its leadership as the global interconnect solution provider
for the TOP500 list of supercomputers. Mellanox reported that the number of
the TOP500's Petascale-capable systems connected with Mellanox FDR InfiniBand
doubled from November 2012 to June 2013. According to the Company, the
advanced offloads and accelerations within Mellanox InfiniBand solutions
enable the most performance-efficient systems on the TOP500 list, at nearly
96% system and CPU efficiency. "We are pleased to see the increased adoption
of our FDR InfiniBand interconnect solutions by the world's fastest
supercomputers," said Eyal Waldman, President and CEO of Mellanox
Technologies. "FDR InfiniBand delivers today the highest performance for
high-performance computing, cloud, Web 2.0, database and storage applications.
We continue with our development efforts to bring the next generation of
100Gb/s interconnect solutions, which are expected to be released in 2014/2015
time frame." The Full Research Report on Mellanox Technologies, Ltd. -
including full detailed breakdown, analyst ratings and price targets - is
available to download free of charge at:
[http://www.wsreports.com/r/full_research_report/4da9_MLNX]

--

Vishay Intertechnology Inc. Research Report

On June 18, 2013, Vishay Intertechnology, Inc. (Vishay) introduced the
industry's first thermal fuses to offer high current capabilities up to +160
°C for 1,000 hours without unexpected breakdown. The AEC-Q200 tested, devices
in the new Vishay Beyschlag HCTF series also provide a safety interrupt of
electrical power in high-current automotive applications. According to the
Company, in the case of excess heat in the range of the functioning
temperature of +235 °C (+/- 15 K), HCTF thermal fuses open automatically and
disconnect the circuit. Vishay informed that typical applications for HCTF
devices include automotive power electronics that can be connected to steady
battery power (B+ or terminal number 30), such as control units of fans and
pumps for liquid engine cooling, inlet air control units, diesel pre-heaters,
engine control units, ABS control units, and diesel heater plugs relays. The
Full Research Report on Vishay Intertechnology Inc. - including full detailed
breakdown, analyst ratings and price targets - is available to download free
of charge at: [http://www.wsreports.com/r/full_research_report/2481_VSH]

--

Cavium, Inc. Research Report

On June 17, 2013, Cavium, Inc. (Cavium) reported that it has licensed and
incorporated Imagination Technologies' latest Release 5 MIPS architecture
(MIPSr5) features, including hardware virtualization, in all members of its
ultra-high-performance 1 - 48 core OCTEON III family of products. Jim
Whittaker, Executive Vice President (EVP) of Processor Group at Imagination
Technologies believes that Cavium has created some of the industry's most
advanced 64-bit multi-core processors for networking, wireless and storage. M.
Raghib Hussain, Corporate VP/General Manager and Chief Technology Officer,
Cavium, said, "The MIPSr5 architecture enhancements from Imagination combined
with Cavium's in-house design expertise will help create the most advanced
MIPS 64-bit processor in the industry and will serve to further extend our
leadership in the network infrastructure market." The Full Research Report on
Cavium, Inc. - including full detailed breakdown, analyst ratings and price
targets - is available to download free of charge at:
[http://www.wsreports.com/r/full_research_report/6759_CAVM]

--

Integrated Device Technology, Inc. Research Report

On June 17, 2013, Integrated Device Technology Inc. (IDT) announced that the
IDT CPS-1848 and CPS-1616 Gen 2 Serial RapidIO switches provide the key system
interconnect for the low-power BrownDwarf Supercomputer developed by nCore HPC
and Prodrive. IDT said that its RapidIO switches offer 20 Gbps throughput per
port with the lowest latency and the highest performance-per-watt compared to
other interconnects. "RapidIO is key to the multi-processor peer-to-peer
processing needs that are emerging in both supercomputing and data center
applications," said Tom Sparkman, Vice President and General Manager of the
Communications Division at IDT. "With the growth of processor-to-processor
traffic in these applications, IDT's RapidIO switches bring the critical
attributes of embedded systems to offer improved system-level performance,
throughput, latency, and energy efficiency." The Full Research Report on
Integrated Device Technology, Inc. - including full detailed breakdown,
analyst ratings and price targets - is available to download free of charge
at: [http://www.wsreports.com/r/full_research_report/2dc9_IDTI]

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