Deca Technologies Introduces Chris Seams as New CEO

Deca Technologies Introduces Chris Seams as New CEO 
Brings Operational, Manufacturing, and Sales and Marketing Management
Experience to Lead Growth in Wafer Level Packaging Market 
TEMPE, AZ -- (Marketwired) -- 06/24/13 --  Deca Technologies, an
electronic interconnect solutions provider to the semiconductor
industry, today announced it has named semiconductor industry veteran
Chris Seams its new CEO. Seams brings more than 25 years expertise in
managing operations, manufacturing, and sales and marketing. He has
also been appointed to the Company's board of directors. 
Seams joins Deca from Cypress Semiconductor Corporation, where he
served as executive vice president of Sales and Marketing. He takes
over for Tim Olson, who will now serve as Deca's Chief Technology
Officer and a member of its board of directors. 
"Deca has two key value propositions: truly revolutionary wafer level
packaging technology and industry-leading manufacturing efficiency,"
said T.J. Rodgers, chairman of Deca's board of directors. "Chris
brings a wealth of manufacturing experience to the position. He
directly managed Cypress' manufacturing for 14 years, building up its
reputation for world-class efficiency. We are confident Chris will
successfully build upon Deca's strong inroads with top customers and
lay the groundwork for the next level of the company's growth." 
"This is an exciting time to be joining Deca," said Seams. "The
company is poised for rapid growth with the continued development of
its offerings. I welcome the opportunity to lead Deca's efforts to
bring the potential of our wafer scale packaging capabilities to
reality. In so doing, we will transform the way our customers -- the
leading semiconductor manufacturers around the world -- approach
wafer level packaging." 
Seams joined Cypress in 1990, where other assignments included
technical and operational management in manufacturing, development,
and operations. Prior to joining Cypress, he worked in process
development for Advanced Micro Devices and Philips Research
Seams is a senior member of IEEE, serves on the Engineering Advisory
Council for Texas A&M University, and is on the board of directors of
Tessera Technologies, Inc. Seams earned his bachelor's degree in
electrical engineering from Texas A&M University and his master's
degree in electrical and computer engineering from the University of
Texas at Austin. 
About Deca Technologies Inc 
 Founded in 2009 and launched in
November 2011, Deca Technologies is an electronic interconnect
solutions provider offering wafer level packaging (WLP) services to
the semiconductor industry. Headquartered in Tempe, AZ and with
global capabilities, Deca is a majority-owned and fully independent
subsidiary of Cypress Semiconductor Corp. (NASDAQ: CY). Deca's
mission is to deliver an exceptional customer experience through its
proprietary and transformative interconnect technology. 
Integrating its solar and semiconductor background, Deca leverages
unique equipment, processes and operational methods to break down
traditional barriers in the continued adoption and growth of next
generation wafer level electronic interconnect. 
For more information, please visit 
The Deca Technologies logo is a trademark of Deca Technologies. All
other trademarks are the property of their respective owners.  
Company Contact:
Garry Pycroft
VP Sales and Marketing Partner
Deca Technologies
Tel + 1 480 345 9895  
Amy Smith 
Impress Labs
401 369 9266 
Press spacebar to pause and continue. Press esc to stop.