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Rudolph Announces the JetStep Panel Lithography System for Advanced Packaging

  Rudolph Announces the JetStep Panel Lithography System for Advanced
  Packaging

   Unique stepper design is driven by the semiconductor advanced packaging
                 transition from wafer to panel manufacturing

Business Wire

FLANDERS, N.J. -- June 24, 2013

Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process
characterization, photolithography equipment and software for the
semiconductor, FPD, LED and solar industries, today announced the Company’s
entry into the emerging advanced packaging panel lithography market with the
innovative JetStep^™ Panel Lithography System, the latest technological
evolution in Rudolph’s total lithography solution.

COO Benefits Drive Revolutionary Change in Advanced Packaging Photolithography
Scalable technology is rapidly increasing in importance. To improve their cost
of ownership (COO) and increase productivity, advanced packaging facilities
are transitioning to large panels ranging up to Gen 3.5 (approximately 650mm x
720mm). Enlarging the substrate size has been the natural approach, however,
traditional technology has been limited to standard wafer sizes. With
companies progressively moving to fan-out packages, they are no longer limited
to operating within the constraints of a round wafer.

By responding to market opportunities and addressing the stringent demands of
their customers’ technical roadmaps, Rudolph is optimally positioned to
capture first mover advantage in the emerging market of advanced packaging
panel lithography. Customers could require wafer tool suppliers to redesign
their tools to handle large panels, or they could have panel tool suppliers
learn how to expose semiconductors. Rudolph’s unique tool design provides a
compelling solution by delivering against both sets of requirements, while
avoiding the risks inherent in any development program undertaken by a panel
or wafer tool supplier. The JetStep Panel Lithography System, having emerged
from the flat panel display market, is readily capable of processing both
glass and organic laminate panels in the semiconductor advanced packaging
market.

“Moving from reconstituted wafers to chips-on-panels is a significant, natural
evolution of the advanced packaging platform,” said Elvino da Silveira, chief
technology officer of Rudolph’s Lithography Systems Group. “This new substrate
size is uniquely suited to Rudolph’s expertise in advanced packaging
applications as well as panel-processing capabilities. The stepper’s inherent
ability to handle panels reinforces the strategic vision behind this product
introduction and market entry.”

As resolution, overlay and other technical specifications become more critical
in advanced packaging processes, back-end manufacturers are choosing to move
from aligners to steppers to meet these requirements. The JetStep Panel
Lithography System, combining unique LCD manufacturing and advanced packaging
features and requirements, joins the previously announced JetStep Lithography
System for general advanced packaging lithography. In addition to on-the-fly
autofocus for thick photoresists, an onboard reticle library and six-second
reticle change out wheel, the JetStep Panel Lithography System can utilize
Rudolph’s suite of software products—ProcessWORKS^® Software for run-to-run
control, Discover^® Software for yield management and ARTIST^® Software for
fault detection and classification—to provide a comprehensive solution for
virtually any advanced packaging application.

“Rudolph has the technological foundation required for a panel lithography
system,” noted Paul F. McLaughlin, chairman and chief executive officer. “Our
combined application knowledge in advanced packaging and flat panel display
ideally positions us to lead the way in this new market. Our vision for
Rudolph is to establish the Company as the vendor of choice for advanced
packaging and photolithography solutions. We have been working in close
collaboration with our customers to further define solutions in accordance
with their roadmaps. The biggest advantage provided to our customers is in
throughput, as the number of die that can be processed in a given amount of
time results in a compelling COO advantage over wafers. The introduction of
the JetStep Panel Lithography System further solidifies our market-leading
position. While we anticipate adoption of the new system in mid-2014, we are
currently demonstrating this panel exposure technology today in our
lithography manufacturing facility in Wilmington, Massachusetts.”

For more information about Rudolph’s JetStep Panel Lithography System, visit
www.rudolphtech.com.

About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development,
manufacture and support of defect inspection, advanced packaging lithography,
process control metrology, and data analysis systems and software used by
semiconductor device manufacturers worldwide. Rudolph provides a full-fab
solution through its families of proprietary products that provide critical
yield-enhancing information, enabling microelectronic device manufacturers to
drive down the costs and time to market of their products. The Company’s
expanding portfolio of equipment and software solutions is used in both the
wafer processing and final manufacturing of ICs, and in adjacent markets such
as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports
its customers with a worldwide sales and service organization. Additional
information can be found on the Company’s website at www.rudolphtech.com.

Safe Harbor Statement
This press release contains forward-looking statements within the meaning of
the Private Securities Litigation Reform Act of 1995 (the “Act”) which include
the benefits to customers of Rudolph’s products, Rudolph’s existing market
position and its ability to maintain and advance such position relative to its
competitors and Rudolph’s ability to meet the expectations and needs of our
customers as well as other matters that are not purely historical data.
Rudolph wishes to take advantage of the “safe harbor” provided for by the Act
and cautions that actual results may differ materially from those projected as
a result of various factors, including risks and uncertainties, many of which
are beyond Rudolph’s control. Such factors include, but are not limited to,
delays in shipping products for technical performance, component supply or
other reasons, the company’s ability to leverage its resources to improve its
positions in its core markets and fluctuations in customer capital spending.
Additional information and considerations regarding the risks faced by Rudolph
are available in Rudolph’s Form 10-K report for the year ended December 31,
2012 and other filings with the Securities and Exchange Commission. As the
forward-looking statements are based on Rudolph’s current expectations, the
company cannot guarantee any related future results, levels of activity,
performance or achievements. Rudolph does not assume any obligation to update
the forward-looking information contained in this press release.

Contact:

Investors:
Rudolph Technologies, Inc.
Steven R. Roth, 973-448-4302
steven.roth@rudolphtech.com
or
Guerrant Associates
Laura Guerrant-Oiye, 808-882-1467
Principal
lguerrant@guerrantir.com
or
Trade Press:
Rudolph Technologies, Inc.
Amy Pauling, 952-259-1794
amy.pauling@rudolphtech.com