Rudolph to Participate in the Fifth Annual CEO Investor Summit 2013

  Rudolph to Participate in the Fifth Annual CEO Investor Summit 2013

     Accredited investor and publishing research analyst event to be held
     concurrently with SEMICON West and Intersolar 2013 in San Francisco

Business Wire

FLANDERS, N.J. -- June 21, 2013

Rudolph Technologies, Inc. (NASDAQ: RTEC) today announced that the Company’s
management will participate in the Fifth Annual CEO Investor Summit 2013,
Wednesday July 10, 2013 in San Francisco, California. Paul McLaughlin,
Chairman and CEO will provide an overview of the Company and will discuss its
competitive position and future prospects.

About The 5th Annual CEO Summit
The CEO Summit is an accredited investor and publishing research analyst event
that is held concurrently with SEMICON^® West and Intersolar 2013 in San
Francisco. The event is hosted by executive management from participating
companies and will feature a “round-robin” format consisting of small group
meetings, each 30 minutes in duration.

The CEO Investor Summit is by invitation only and is open to accredited
investors and publishing research analysts. As space is limited, please RSVP
early. Hosts reserve the right to limit attendance as necessary.

While held concurrently with SEMICON West and Intersolar 2013, the event is
not affiliated with the show.

RSVP Contacts for 5th Annual CEO Summit 2013
To RSVP for the CEO Summit, please contact either of the Summit’s co-chairs.

                                  
Laura J. Guerrant-Oiye                Claire E. McAdams
Guerrant Associates                   Headgate Partners LLC
Phone: (808) 882-1467                 Phone: (530) 265-9899
Email: lguerrant@guerrantir.com       Email: claire@headgatepartners.com


About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development,
manufacture and support of defect inspection, advanced packaging lithography,
process control metrology, and data analysis systems and software used by
semiconductor device manufacturers worldwide. Rudolph provides a full-fab
solution through its families of proprietary products that provide critical
yield-enhancing information, enabling microelectronic device manufacturers to
drive down the costs and time to market of their products. The Company’s
expanding portfolio of equipment and software solutions is used in both the
wafer processing and final manufacturing of ICs, and in adjacent markets such
as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports
its customers with a worldwide sales and service organization. Additional
information can be found on the Company’s website at www.rudolphtech.com.

Contact:

Rudolph Technologies, Inc.
Investors:
Laura Guerrant-Oiye, 808-882-1467
lguerrant@guerrantir.com
or
Trade Press:
Amy Pauling, 952-259-1794
amy.pauling@rudolphtech.com
 
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