STMicroelectronics Signs Comprehensive Agreement With Rambus

STMicroelectronics Signs Comprehensive Agreement With Rambus 
Agreement Covers FD-SOI Design, Security, and Memory and Interface
Technologies and Settles All Outstanding Claims 
GENEVA -- (Marketwired) -- 06/17/13 --   STMicroelectronics (NYSE:
STM), a global semiconductor leader serving customers across the
spectrum of electronics applications, today announced that it has
signed a comprehensive agreement with Rambus Inc. (NASDAQ: RMBS) that
expands existing licenses between the two Companies, settles all
outstanding claims, and commits both organizations to explore
additional opportunities for collaboration.  
The multifaceted agreement gives Rambus access to ST's Fully-Depleted
Silicon On Insulator (FD-SOI) process-technology design environment.
With this, Rambus will be able to benefit from FD-SOI's reduced
silicon geometries and lower power consumption at 28nm and below in
its future memory and interface solutions.  
For its part, ST has secured license terms from the Cryptography
Research, Inc. (CRI) division of Rambus to make it possible for ST to
deploy Differential Power Analysis (DPA) countermeasures and
CryptoFirewall(TM) core security technology across a wider range of
products. DPA is a form of attack that involves monitoring the
fluctuating electrical power consumption of a target device and then
using statistical methods to derive cryptographic keys and other
secrets. DPA countermeasures are used to protect secret cryptographic
keys, including those used to secure transactions for banking,
identity, pay television, video gaming, smartphones, government, and
other applications.  
CryptoFirewall cores are complete hardware-based security blocks
designed by CRI to protect against a wide range of attacks and
tampering techniques.  
The new terms allow ST to further strengthen the security robustness
of its leading-edge set-top box ICs and gateways for multimedia
services including PayTV.  
"This agreement with Rambus is an exceptional win-win-win for both
parties, as they can now share and use more broadly important
technologies that have great value to us, the industry and our
customers," said Gian Luca Bertino, Executive Vice President Digital
Convergence Group, STMicroelectronics. "While Rambus can now use our
revolutionary FD-SOI process technology in its designs, ST intends to
further enhance the security of our outstanding set-top box ICs and
to deploy DPA countermeasures across the whole range of our relevant
product portfolio."  
"ST has implemented DPA countermeasure technology for years in its
secure microcontrollers and has been a leader in data security", said
Paul Kocher, President and Chief Scientist at the Cryptography
Research division of Rambus. "With this new comprehensive and
mutually beneficial agreement, our technology will be further
deployed across a wide array of products and applications,
benefitting customers by improving the security of digital systems." 
In settling all outstanding claims, the agreement also covers ST's
use of Rambus' patented memory interface and serial-link innovations. 
About STMicroelectronics
 ST is a global leader in the semiconductor
market serving customers across the spectrum of sense and power and
automotive products and embedded processing solutions. From energy
management and savings to trust and data security, from healthcare
and wellness to smart consumer devices, in the home, car and office,
at work and at play, ST is found everywhere microelectronics make a
positive and innovative contribution to people's life. By getting
more from technology to get more from life, ST stands for
life.augmented. 
In 2012, the Company's net revenues were $8.49 billion. Further
information on ST can be found at www.st.com. 
For further information, please contact:
INVESTOR RELATIONS:
Tait Sorensen
Group VP, Investor Relations
Tel: +1 602 485 2064
tait.sorensen@st.com 
MEDIA RELATIONS:
Nelly Dimey
Director, Corporate Media and Public Relations
Tel: +33 1 58 07 77 85
nelly.dimey@st.com 
ST RAMBUS
http://hugin.info/152740/R/1710078/566890.pdf