STMicroelectronics : STMicroelectronics Signs Comprehensive Agreement with Rambus

  STMicroelectronics : STMicroelectronics Signs Comprehensive Agreement with

      Agreement covers FD-SOI design, security, and memory and interface
               technologies and settles all outstanding claims

Geneva, June 17, 2013 - STMicroelectronics (NYSE: STM), a global semiconductor
leader serving customers across the spectrum of electronics applications,
today announced that it has signed a comprehensive agreement with Rambus Inc.
(NASDAQ:RMBS) that expands existing licenses between the two Companies,
settles all outstanding claims, and commits both organizations to explore
additional opportunities for collaboration.

The multifaceted agreement gives Rambus access to ST's Fully-Depleted Silicon
On Insulator (FD-SOI) process-technology design environment. With this, Rambus
will be able to benefit from FD-SOI's reduced silicon geometries and lower
power consumption at 28nm and below in its future memory and interface

For its part, ST has secured license terms from the Cryptography Research,
Inc. (CRI) division of Rambus to make it possible for ST to deploy
Differential Power Analysis (DPA) countermeasures and CryptoFirewall(TM) core
security technology across a wider range of products. DPA is a form of attack
that involves monitoring the fluctuating electrical power consumption of a
target device and then using statistical methods to derive cryptographic keys
and other secrets. DPA countermeasures are used to protect secret
cryptographic keys, including those used to secure transactions for banking,
identity, pay television, video gaming, smartphones, government, and other

CryptoFirewall cores are complete hardware-based security blocks designed by
CRI to protect against a wide range of attacks and tampering techniques.

The new terms allow ST to further strengthen the security robustness of its
leading-edge set-top box ICs and gateways for multimedia services including

"This agreement with Rambus is an exceptional win-win-win for both parties, as
they can now share and use more broadly important technologies that have great
value to us, the industry and our customers," said Gian Luca Bertino,
Executive Vice President Digital Convergence Group, STMicroelectronics. "While
Rambus can now use our revolutionary FD-SOI process technology in its designs,
ST intends to further enhance the security of our outstanding set-top box ICs
and to deploy DPA countermeasures across the whole range of our relevant
product portfolio."

"ST has implemented DPA countermeasure technology for years in its secure
microcontrollers and has been a leader in data security", said Paul Kocher,
President and Chief Scientist at the Cryptography Research division of Rambus.
"With this new comprehensive and mutually beneficial agreement, our technology
will be further deployed across a wide array of products and applications,
benefitting customers by improving the security of digital systems."

In settling all outstanding claims, the agreement also covers ST's use of
Rambus' patented memory interface and serial-link innovations.

About STMicroelectronics

ST is a global leader in the semiconductor market serving customers across the
spectrum of sense and power and automotive products and embedded processing
solutions. From energy management and savings to trust and data security, from
healthcare and wellness to smart consumer devices, in the home, car and
office, at work and at play, ST is found everywhere microelectronics make a
positive and innovative contribution to people's life. By getting more from
technology to get more from life, ST stands for life.augmented.

In 2012, the Company's net revenues were $8.49 billion. Further information on
ST can be found at

For further information, please contact:

Tait Sorensen
Group VP, Investor Relations
Tel: +1 602 485 2064

Nelly Dimey
Director, Corporate Media and Public Relations
Tel: +331 5807 77 85



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Source: STMicroelectronics via Thomson Reuters ONE
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