TowerJazz Announces Its Second Half 2013 Global Conference Roadmap; Plenary and Breakout Sessions to Meet Geographic Customer

  TowerJazz Announces Its Second Half 2013 Global Conference Roadmap; Plenary
  and Breakout Sessions to Meet Geographic Customer Needs

Technical Global Symposium (TGS) “Around the Globe” expands to include Israel,
 Japan, and China in addition to US; Focus is on multi-sourcing capabilities
                         and ramp of new technologies

Business Wire

MIGDAL HAEMEK, Israel -- June 13, 2013

TowerJazz, the global specialty foundry leader, today announced its global
conference roadmap for the second half of 2013. The locations and dates of its
Technical Global Symposium (TGS) “Around the Globe” is expanding to meet the
geographic needs of its customers. TGS in Japan will take place on July 24,
China is planned for September (TBD), Israel for October (TBD) and TGS in the
US will take place on November 12-13, 2013. At each location, the event will
include a keynote from TowerJazz CEO Russell Ellwanger, presentations by
additional company executives, and case studies from TowerJazz customers. In
addition, TowerJazz’s latest process technology advancements will be featured
including: a next-generation RF SOI platform for handset RF switches and
antenna tuners, power amplifier (PA) SiGe technology with advanced features
such as thick-Cu interconnects, high-resistivity substrates and TSV, RF MEMS,
0.18um BCD with very-low Rdson devices for power management ICs, and 700V
technology for LED lighting and AC/DC conversion, among others.

The theme for TGS 2013 is “From Innovation to Manufacturing for a Smart
World.” Presentations will highlight new technologies, their inceptions, their
potential, and how TowerJazz has enabled efficient multi-sourcing and quick
ramp to volume production. In addition, TowerJazz executives will discuss how
the company’s process offerings and design enablement address the three
megatrends in the semiconductor industry: 1) Smart Everything, 2) Wireless
Everywhere, and 3) Green Everything, along with the implications to fabless
companies, integrated device manufacturers and foundries.

As TowerJazz’s worldwide presence continues to grow, TGS “Around the Globe”
will further strengthen the foundry’s visibility among customers in multiple
regions, build awareness for its broad range of offerings and provide
highlights from each business unit: SiGe/RF/HPA, power management, CMOS image
sensors (CIS), mixed-signal CMOS, MEMS, Transfer Optimization and development
Process Services (TOPS), and Aerospace & Defense. TowerJazz will also present
its latest set of sophisticated design kits and models as well as its
comprehensive analog IP portfolio. In addition, TowerJazz’s foundry partners
-- the leading EDA vendors and tool providers -- will be present to exhibit
and demo their solutions to address the design needs of mutual customers.

“TowerJazz continues to expand incrementally year after year, not just
geographically and from the standpoint of increased capacity, but by advancing
our technology offerings to address fast growing markets such as front-end
module (FEM), LED lighting, machine vision, and RF MEMS as well as expanding
our process transfer capabilities,” said Russell Ellwanger, TowerJazz Chief
Executive Officer. “Through this technical global symposium, attendees will
gain knowledge about the latest advancements in our technology offerings and
multi-sourcing foundry capabilities. We will show how TowerJazz’s expertise
within specialty technologies is solidly aligned to the industry megatrends,
and as such enables our customers to ride these trends successfully and grow
more rapidly in the marketplace.”

Registration for TGS “Around the Globe” is available on TowerJazz’s website

About TowerJazz

Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM), its fully owned U.S.
subsidiary Jazz Semiconductor Ltd., and its fully owned Japanese subsidiary
TowerJazz Japan, Ltd., operate collectively under the brand name TowerJazz,
the global specialty foundry leader. TowerJazz manufactures integrated
circuits, offering a broad range of customizable process technologies
including: SiGe, BiCMOS, Mixed-Signal/CMOS, RFCMOS, CMOS Image Sensor, Power
Management (BCD), and MEMS capabilities. TowerJazz also provides a world-class
design enablement platform that enables a quick and accurate design cycle. In
addition, TowerJazz provides (TOPS) Transfer Optimization and development
Process Services to IDMs and fabless companies that need to expand capacity.
TowerJazz offers multi-fab sourcing with two manufacturing facilities in
Israel, one in the U.S., and one in Japan. For more information, please visit

Safe Harbor Regarding Forward-Looking Statements

This press release includes forward-looking statements, which are subject to
risks and uncertainties. Actual results may vary from those projected or
implied by such forward-looking statements. A complete discussion of risks and
uncertainties that may affect the accuracy of forward-looking statements
included in this press release or which may otherwise affect TowerJazz’s
business is included under the heading "Risk Factors" in Tower’s most recent
filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and
Exchange Commission (the “SEC”) and the Israel Securities Authority and Jazz’s
most recent filings on Forms 10-K and 10-Q, as were filed with the SEC,
respectively. Tower and Jazz do not intend to update, and expressly disclaim
any obligation to update, the information contained in this release.


Asia Company/Media Contact:
Shoko Saimiya, 81-795-23-6609
Europe Company/Media Contact:
Limor Silberberg, +972-4-604-7249
US Company/Media Contact:
Lauri Julian, +1 949 435 8181
Investor Relations Contact:
Noit Levi, +972-4-604-7066
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