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Chip Scale Schottky from Diodes Incorporated Doubles Power Density

  Chip Scale Schottky from Diodes Incorporated Doubles Power Density

Business Wire

PLANO, Texas -- June 6, 2013

Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier
of high-quality application specific standard products within the broad
discrete, logic and analog semiconductor markets, today announced its first
wafer-level, chip-scale packaged Schottky diode. The SDM0230CSP provides
smartphone and tablet designs with an alternative to miniature
DFN0603-packaged devices, while offering twice the power density in the same
PCB footprint.

In the X3-WLCUS0603-3 solder pad package, the 30V, 0.2A SDM0230CSP Schottky
diode has a typical thermal resistance of just 261ºC/W. This is around half
that of the DFN0603 package so power dissipation is doubled in switching,
reverse-blocking and rectification circuits.

Utilizing 70% less board space than the industry-standard DFN1006 and SOD923
packaged Schottkys, the 0.18mm^2 footprint SDM0230CSP is well suited to
high-density design. Additionally, its 0.3mm off board profile is 25% thinner,
benefiting ultra-thin portable products.

The Schottky’s low maximum forward voltage of just 0.5V for a forward current
of 0.2A, combined with a typical low leakage current of only 1.5mA at a
reverse voltage of 30V, means it minimizes power losses, thus extending
battery life. For further information, visit the Company’s website at
www.diodes.com.

About Diodes Incorporated

Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor's SmallCap 600 and
Russell 3000 Index company, is a leading global manufacturer and supplier of
high-quality application specific standard products within the broad discrete,
logic and analog semiconductor markets. Diodes serves the consumer
electronics, computing, communications, industrial, and automotive markets.
Diodes' products include diodes, rectifiers, transistors, MOSFETs, protection
devices, functional specific arrays, single gate logic, amplifiers and
comparators, Hall-effect and temperature sensors; power management devices,
including LED drivers, AC-DC converters and controllers, DC-DC switching and
linear voltage regulators, and voltage references along with special function
devices, such as USB power switches, load switches, voltage supervisors, and
motor controllers. Diodes’ corporate headquarters, logistics center, and
Americas' sales office are located in Plano, Texas. Design, marketing, and
engineering centers are located in Plano; San Jose, California; Taipei,
Taiwan; Manchester, England; and Neuhaus, Germany. Diodes’ wafer fabrication
facilities are located in Kansas City, Missouri and Manchester, with two more
located in Shanghai, China. In addition, two assembly-test facilities are
located in Shanghai; two are located in Chengdu, China, with one in Neuhaus
and one in Taipei. Additional engineering, sales, warehouse, and logistics
offices are located in Fort Worth, Texas; Taipei; Hong Kong; Manchester;
Shanghai; Shenzhen, China; Seongnam-si, South Korea; Suwon, South Korea;
Tokyo, Japan; and Munich, Germany, with support offices throughout the world.
For further information, including SEC filings, visit Diodes’ website at
http://www.diodes.com.

Contact:

Company Contact:
Diodes Incorporated
Francis Tang
VP, Worldwide Discrete Products
P: 972-987-3900
E: pressinquiries@diodes.com
or
Investor Relations Contact:
Shelton Group
Leanne K. Sievers
EVP, Investor Relations
P: 949-224-3874
E: lsievers@sheltongroup.com
 
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