eSilicon and GLOBALFOUNDRIES Partner With QuickLogic to Deliver the ArcticLink(R) III Family of Display Bridge Solutions

eSilicon and GLOBALFOUNDRIES Partner With QuickLogic to Deliver the 
ArcticLink(R) III Family of Display Bridge Solutions 
Concurrent Package Design and Foundry Execution Were Critical Factors
to Hit Narrow Market Window 
SUNNYVALE, CA -- (Marketwired) -- 06/03/13 --  eSilicon Corporation,
the largest independent semiconductor design and manufacturing
services provider, and GLOBALFOUNDRIES used concurrent design and
emerging SoC packaging technology to deliver QuickLogic Corporation's
ArcticLink(R) III family of display bridges under extreme market
window pressure. 
QuickLogic had identified an opportunity for a high-volume,
low-power, low-cost display-bridging solution. Hitting a narrow
market window required working with semiconductor development
partners with the capabilities to deliver QuickLogic's family of
devices within power, size and cost constraints, including: 


 
--  Physical design
--  Package design
--  Foundry execution
--  Concurrent package design methodology

  
"eSilicon's ability to take on a 65nm design quickly to meet our market
window was paramount. Additionally eSilicon's full-service back-end
capabilities, including in-house expertise in emerging package
technology, benefitted the overall project," said Rajiv Jain, senior
director of operations, QuickLogic.  
eSilicon's package design team determined that a fan-out wafer-level
chip-scale package (FOWLCSP) would address the size, power, and cost
constraints and provide the following advantages: 


 
--  Smaller form factor
--  Better electrical and thermal dissipation
--  Reduced cost due to denser I/Os and less aggressive foundry rules
--  Over-mold for increased reliability
--  Simpler supply chain: the substrate house and substrate inventories
    were no longer needed
--  Simpler assembly: the bump interconnect and bond wires were no longer
    needed

  
"When we originally planned the device, we selected a wire-bond
package, based on certain assumptions. However, MIPI interface
constraints, coupled with a disproportionately high number of I/Os on
one side of the die, made the wire-bond package impossible to use. We
decided to use an FOWLCSP package. After completing a detailed risk
assessment, we determined this was the most cost-effective solution
to meet market requirements," said Javier DeLaCruz, senior director
of engineering, eSilicon. 
Concurrent Design Required
 However, cost-effective FOWLCSP design
requires that package design drives floor planning and pattern
layout, including optimizing I/O placement. Although this is
challenging when these design functions are outsourced to different
suppliers, eSilicon's concurrent design methodology accommodates it
easily, resulting in a design that takes advantage of everything this
platform has to offer. 
For example, eSilicon's package design team placed the I/Os in a ring
pattern in order to use a single redistribution layer. This
innovative approach resulted in a minimum die size, improved power
delivery and reduced foundry and assembly costs. 
Foundry Flexibility
 Meeting the tight turn-around time required
crystal clear communication among the business and technology teams
from QuickLogic, eSilicon and GLOBALFOUNDRIES. GLOBALFOUNDRIES also
provided a number of manufacturing services to reduce time and risk: 


 
--  Early access to ensure a first-time-right prototype and enable a
    parallel production launch to reduce time to market
--  Multi-layer mask for lower prototyping NRE and to quickly get
    engineering samples to QuickLogic's customers
--  Exceptional correlation between silicon results and simulation models

  
"Collaboration was the hallmark of our engagement with eSilicon and
their implementation of QuickLogic's family of display-bridge
solutions," said Craig Luhrmann, vice president of channels at
GLOBALFOUNDRIES. "eSilicon employed a broad array of skills in
optimizing the solution, leveraging GLOBALFOUNDRIES technologies and
flexibility."  
QuickLogic Display Bridge Family
 QuickLogic's ArcticLink III
display-bridge solution family uses a 120-ball, 4.5mm x 4.5mm package
with a 0.4mm ball pitch. The display bridge solutions enable OEMs to
quickly solve processor-display bridging challenges, extend battery
life and enhance bright sunlight viewability for mobile applications.
QuickLogic's family of display bridges is currently in production. 
About eSilicon 
 eSilicon, the largest independent semiconductor
design and manufacturing services provider, delivers custom ICs and
custom IP to OEMs, independent device manufacturers (IDMs), fabless
semiconductor companies (FSCs) and wafer foundries through a fast,
flexible, lower-risk path to volume production. eSilicon serves a
wide variety of markets including the communications, computer,
consumer and industrial segments. www.esilicon.com. 
eSilicon -- Enabling Your Silicon Success(TM) 
eSilicon and eSilicon Access are registered trademarks, and the
eSilicon logo and Enabling Your Silicon Success are trademarks, of
eSilicon Corporation. Other trademarks are the property of their
respective owners. 
Contacts:
Sally Slemons
eSilicon Corporation
408-616-4695
sslemons@esilicon.com 
Susan Cain
Cain Communications
408-393-4794
scain@caincom.com