Rudolph Will Participate in Two Investor Conferences
*DA Davidson 5^th Annual Technology Forum
*Credit Suisse Semiconductor Supply Chain Conference
D.A. Davidson 5th Annual Technology Forum
FLANDERS, N.J. -- May 28, 2013
Rudolph Technologies, Inc. (NASDAQ: RTEC) today announced that the Company’s
management will participate in the following investor conferences:
*DA Davidson 5th Annual Technology Forum to be held May 29, 2013 in New
York City, New York.
*Credit Suisse Semiconductor Supply Chain Conference to be held May 30,
2013 in Boston, Massachusetts.
Paul McLaughlin, Chairman and CEO, and Steven Roth, Senior Vice President and
CFO, will provide an overview of the Company and will discuss its competitive
position and future prospects.
For more information about either conference or to schedule a one-on-one
meeting with Rudolph Technologies’ management, please contact your DA Davidson
or Credit Suisse representative directly.
About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development,
manufacture and support of defect inspection, advanced packaging lithography,
process control metrology, and data analysis systems and software used by
semiconductor device manufacturers worldwide. Rudolph provides a full-fab
solution through its families of proprietary products that provide critical
yield-enhancing information, enabling microelectronic device manufacturers to
drive down the costs and time to market of their products. The Company’s
expanding portfolio of equipment and software solutions is used in both the
wafer processing and final manufacturing of ICs, and in adjacent markets such
as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports
its customers with a worldwide sales and service organization. Additional
information can be found on the Company’s website at www.rudolphtech.com.
Rudolph Technologies, Inc.
Laura Guerrant-Oiye, 808-882-1467
Amy Pauling, 952-259-1794
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