Rambus Engineers and Inventors to Present Three Papers at Electronic System Technologies Conference & Exhibition 2013

  Rambus Engineers and Inventors to Present Three Papers at Electronic System
  Technologies Conference & Exhibition 2013

ESTC 2013

Business Wire

SUNNYVALE, Calif. & LAS VEGAS -- May 20, 2013

Rambus Inc.(NASDAQ:RMBS):

Who:     Rambus Inc.

Where:     ESTC 2013
           The New Tropicana
           3801 S Las Vegas Blvd
           Las Vegas, NV 89109

When:      May 20-23, 2013

At the Electronic System Technologies Conference and Exhibition (ESTC) 2013,
Rambus engineers will present three technical papers in the areas of 3-D
interposer design, high frequency effects in physical architectures, and
high-speed parallel buses.

Tuesday, May 21, 2013

Title: “System Design of a Bufferless 6.4 Gb/s Server Multi-DIMM Memory
Interface System”
8:00 a.m. – 12:00 p.m.
Yi Lu, Ravi Kollipara, and Arun Vaidyanath, Rambus

Rambus engineers will discuss details of the system design of a multi-DIMM
memory interface system of 6.4 Gb/s data rate and 1.6 Gb/s C/A rate,
showcasing innovations like fast power down exit and near ground signaling to
reduce idle and active power consumption.

Title: “Consideration of Fiber Weave Effects in Selecting PCB Dielectric
Material for 25/28 Gbps SerDes Applications”
8:00 a.m. – 12:00 p.m.
Gnanadeep Kollipara, David Secker, and Arun Vaidyanath, Rambus

In this paper presentation, Rambus engineers will demonstrate the impacts of
the anisotropy of the fiber weave in one dielectric material by using
identical strip line structures on a single fabricated PCB with traces at
varying rotations.

Thursday, May 23, 2013

Title: “3-D Si Interposer Manufacturing and Design Challenges”
8:00 a.m. – 12:00 p.m.
Ming Li, Mandy Ji, Julia Cline, John Lau, Pei-Jer Tzeng, Chau-Jie Zhan, and
Ching-Kuan Lee, Rambus

In this presentation, Rambus engineers will present a 3-D silicon interposer
design with double-sided active silicon chip attachments. Design and
manufacturing challenges as well as solutions and package structure will be
discussed.

About Rambus Inc.

Rambus is the innovative technology solutions company that brings invention to
market. Unleashing the intellectual power of our world-class engineers and
scientists in a collaborative and synergistic way, Rambus invents, licenses
and develops solutions that challenge and enable our customers to create the
future. While best known for creating unsurpassed semiconductor memory
architectures, Rambus is also developing world-changing products and services
in security, advanced LED lighting and displays, and immersive mobile media.

RMBSTN

Contact:

Schwartz MSL for Rambus
Dan O’Mahony/Darah Roslyn, 415-512-0770
rambus@schwartzmsl.com
 
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