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Applied Materials : Applied Materials to Present at Upcoming Investor Conferences



    Applied Materials : Applied Materials to Present at Upcoming Investor
                                 Conferences

SANTA CLARA, Calif., May 17, 2013 - Applied Materials, Inc. (NASDAQ:AMAT) will
participate in two upcoming investor conferences. On Wednesday, May 29
beginning at 9:30 a.m. ET,  Robert Halliday, Senior Vice President and Chief
Financial Officer, will participate in a question-and-answer discussion at the
Cowen and Company Conference in New York. Mr. Halliday will also participate
in a question-and-answer discussion at the Bank of America Merrill Lynch
Conference in San Francisco on Tuesday, June 4 beginning at 1:00 p.m. ET.

A live webcast of the presentations will be available on the Applied Materials
website at http://www.appliedmaterials.com/investor-relations. A replay of the
Cowen and Company conference will be available beginning May 29 at 5:00 p.m.
ET. A replay of the Bank of America Merrill Lynch conference will be available
beginning June 4 at 5:00 p.m. ET. Both presentations will remain available for
three months.  

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel displays and solar photovoltaic products.
Our technologies help make innovations like smartphones, flat screen TVs and
solar panels more affordable and accessible to consumers and businesses around
the world. Learn more at www.appliedmaterials.com.

                                    # # #

Contact:
Kevin Winston (editorial/media) 408.235.4498
Michael Sullivan (investment community) 408.748.5227

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This announcement is distributed by Thomson Reuters on behalf of Thomson
Reuters clients.

The owner of this announcement warrants that:
(i) the releases contained herein are protected by copyright and other
applicable laws; and
(ii) they are solely responsible for the content, accuracy and originality of
the
information contained therein.

Source: Applied Materials via Thomson Reuters ONE
HUG#1702935
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