u-blox announces collaboration with Intel on dedicated HSPA module

      u-blox announces collaboration with Intel on dedicated HSPA module

Intel's XMM™ 6255 HSPA platform is the engine inside u-blox' low-cost 3G-only
module

PR Newswire

THALWIL, Switzerland and SANTA CLARA, Calif., May 16, 2013

THALWIL, Switzerland and SANTA CLARA, Calif., May 16, 2013 /PRNewswire/
--Swiss-based u-blox, a leading provider of wireless and positioning
semiconductors, software and solutions, announced that the company is
collaborating with Intel Corporation to bring a small, cost-effective 3G-only
HSPA module to the market.

Based on Intel's XMM™ 6255 HSPA modem platform, the chipset will be packaged
in a compact, low-cost module that maintains layout compatibility with u-blox'
SARA 2G and LISA 3G module series. u-blox' 2G-3G-4G nested design philosophy
allows product designers to offer tailored solutions to their target markets
based on a single PCB design. This facilitates product diversity and easy
migration while keeping price at a minimum through reduced design, test,
logistics and certification costs. 

"As operators start to sunset their GSM/GPRS services, we have partnered with
Intel to bring the cost of 3G connectivity down," said Nikolaos Papadopoulos,
president of u-blox America. "For 3G-only M2M devices, our compact HSPA-only
module, which is about the size of a quarter, is layout compatible with our
popular SARA GSM/GPRS wireless module series. This is the perfect combination
for the North American market." The modem supports full HSPA connectivity and
low power consumption in an ultra-small form factor.

"The XMM™ 6255 platform is latest innovation by Intel and specifically
designed for M2M," said Horst Pratsch, head of product line modules and M2M at
Intel Corporation. "Integrating the 3G power amplifier in the transceiver
delivers the smallest possible size and lowest number of components enabling
new applications of 3G in machine-to-machine applications. Intel is pleased to
work with u-blox in bringing this solution to the market."

Based on Intel® X-GOLD™ 625 digital- and analog-baseband with integrated Power
Management Unit and the Intel® SMARTi™ UE2p transceiver for 3G, the Intel®
XMM™ 6255 platform is the smallest available HSPA modem chipset. Its compact
size and powerful HSPA performance enables u-blox to create the world's
smallest dedicated 3G modem module dedicated to operation over 3G networks
worldwide.

For more information about u-blox' HSPA only module, contact the u-blox at
info_us@u-blox.com or on our website at www.u-blox.com.

About u-blox

Swiss-based u-blox (SIX:UBXN) is the global leader in positioning and wireless
semiconductors for the consumer, industrial and automotive markets. Our
solutions enable people, vehicles and machines to locate their exact position
and wirelessly communicate via voice, text or video. With a broad portfolio of
chips, modules and software solutions, u-blox is uniquely positioned to enable
OEMs to develop innovative personal, professional and M2M solutions quickly
and cost-effectively. With headquarters in Thalwil, Switzerland, u-blox is
globally present with offices in Europe, Asia and the USA. (www.u-blox.com)

SOURCE u-blox

Website: http://www.u-blox.com
Contact: Herbert Blaser, Phone: +41 44 722 7469, E-mail:
herbert.blaser@u-blox.com, Sue Ann Murray, Phone: 408.966.9891, E-mail:
murray@tripleplay.net
 
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