Cree’s New Power Module Enables Higher Performance, More Reliable and Lower Cost Power Conversion Systems Compared to State-Of

  Cree’s New Power Module Enables Higher Performance, More Reliable and Lower
  Cost Power Conversion Systems Compared to State-Of-The Art Silicon Modules

  Industry’s First All SiC Three-Phase Power Module Alleviates Conventional
                              Design Constraints

PCIM Europe 2013 Hall 7, Booth 210

Business Wire

DURHAM, N.C. -- May 14, 2013

Cree, Inc. (Nasdaq: CREE) is introducing the industry’s first commercially
available silicon carbide (SiC) six-pack power module in an industry standard
45mm package. When replacing a silicon module with equivalent ratings, Cree’s
six-pack module can reduce power losses by 75 percent, which leads to an
immediate 70 percent reduction in the size of the heat sink or a 50 percent
increase in power density. The new six-pack SiC module unlocks the traditional
design constraints associated with power density, efficiency and cost, thereby
enabling the designer to create high performance, reliable and low cost power
conversion systems. When compared to state-of-the-art silicon modules, the SiC
1.2 kV, 50A modules deliver performance equivalent to silicon modules rated at
150A.

“The efficient switching of the SiC module allows us to use them with
significantly less derating than silicon IGBTs,” stated Dr. Jun Kang, research
and applications manager, Yaskawa America, Inc. “This feature enables
significantly higher frequency operation, which both increases fundamental
output frequency and reduces passive component size in the motor drive.”

“Cree’s SiC power module family can also provide significant benefits to
applications such as solar inverters, uninterruptible power supplies (UPS) and
industrial power supplies,” explained Mrinal Das, product marketing manager,
Cree Power and RF. “Even when designers simply substitute Si modules with SiC
in motor drive applications, the improved performance of SiC reduces power
losses, leading to reduced cooling requirements and, in turn, to a reduction
in size, weight, complexity and the overall cost of the power electronics
system.”

The CCS050M12CM2 six-pack modules from Cree are available for immediate
shipping through Digi-Key Corporation and Mouser Electronics. Gate driver ICs
suitable for SiC MOSFETs are available from IXYS and Texas Instruments.
Complete gate driver boards (CRD-001) are available as samples from Cree upon
request. For further information about the new Cree^® SiC six-pack module
please visit www.cree.com/SiC-modules. Visitors to the PCIM 2013 Conference,
May 14–16 in Nuremburg, Germany, can learn more about the new six-pack module
at Hall 7, Booth 210.

About Cree

Cree is a market-leading innovator of semiconductor products for power and
radio-frequency (RF) applications, lighting-class LEDs and LED lighting
solutions.

Cree's product families include LED fixtures and bulbs, blue and green LED
chips, high-brightness LEDs, lighting-class power LEDs, power-switching
devices and RF devices. Cree products are driving improvements in applications
such as general illumination, electronic signs and signals, power supplies and
solar inverters.

For additional product and company information, please refer to www.cree.com.

This press release contains forward-looking statements involving risks and
uncertainties, both known and unknown, that may cause actual results to differ
materially from those indicated. Actual results may differ materially due to a
number of factors, including the risk that actual savings will vary from
expectations; the risk we may be unable to manufacture these new products with
sufficiently low cost to offer them at competitive prices or with acceptable
margins; the risk we may encounter delays or other difficulties in ramping up
production of our new products;  customer acceptance of our new products; the
rapid development of new technology and competing products that may impair
demand or render Cree’s products obsolete; and other factors discussed in
Cree’s filings with the Securities and Exchange Commission, including its
report on Form 10-K for the year ended June 24, 2012, and subsequent filings.

Cree^® is a registered trademark of Cree, Inc.

Contact:

Cree, Inc.
Gena Fiegel, 919-407-7651
Corporate Communications
media@cree.com
 
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