Axcelis Extends Purion Platform With The Launch Of The Purion XE High Energy
Innovative Platform Delivers Industry Leading Purity, Precision and
Productivity for the 16nm Era and Beyond
BEVERLY, Mass., April 30, 2013
BEVERLY, Mass., April 30, 2013 /PRNewswire/ -- Axcelis Technologies, Inc.
(Nasdaq: ACLS) today announced the introduction of the Purion XE next
generation single wafer high energy implanter, the second tool in its
expanding family of Purion ion implanters. The Purion XE is an evolution of
the industry leading Optima XEx, combining the process and productivity
advantages of the Optima XEx linear accelerator and beamline technology with
the reliability, precision, process flexibility, and performance options that
define the Purion platform. The Axcelis single wafer LINAC technology is the
industry benchmark for high energy productivity and lowest cost of ownership,
while providing customers remarkable manufacturing flexibility with true
medium current capability. Each member of the Purion family shares a common,
powerful 500+ wafers per hour end station, industry leading source technology
and an innovative and productive ultra-pure beam line.
Bill Bintz, senior vice president of marketing said, "The Purion platform
redefines what chipmakers have come to expect from an ion implanter. It
represents the most significant advance in next generation ion implanter
platform design, and we're excited to expand the Purion into the high energy
segment. We developed the Purion platform in response to customer requirements
for absolute beam purity and the most precise dopant placement possible, while
ensuring the highest levels of productivity and capital efficiency. Each
product in the platform is designed to be the leader in its segment, in every
measurable way, and together provide a powerful solution to chip
manufacturers' challenges in the sub 16nm era and beyond."
The Purion Platform enables high yield manufacture of sub 16nm planar and 3-D
devices. All Purion implanters incorporate industry leading advanced
filtration systems, for unsurpassed beam purity, so even the most sensitive
devices are implanted for optimized device performance. The platform's
industry leading angle control system and constant focal length scanning
deliver the most precise and repeatable dopant placement available today. The
scanned spot beam architecture designed into the platform enables control of
damage engineering as well as other advanced process enabling implants using
materials modification techniques required in leading edge device processes.
The common elements of the Purion platform were designed to drive
manufacturing flexibility and lower the total cost of fab operations. Common
platform architecture and system options enable ease of process transfer
between systems, simplified maintenance, and improved reliability.
The Purion platform redefines next generation implanter technology and
performance and enables the efficient production of leading edge semiconductor
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing
innovative, high-productivity solutions for the semiconductor industry for
over 35 years. Axcelis is dedicated to developing enabling process
applications through the design, manufacture and complete life cycle support
of ion implantation systems, one of the most critical and enabling steps in
the IC manufacturing process. The Company's Internet address is:
Maureen Hart (editorial/media) 978.787.4266
Jay Zager (financial community) 978.787.9408
SOURCE Axcelis Technologies, Inc.
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