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Rudolph Purchases Selected Assets from Tamar Technology; Adds 3D Measurement Capability for Advanced Packaging Applications



  Rudolph Purchases Selected Assets from Tamar Technology; Adds 3D Measurement
  Capability for Advanced Packaging Applications

 Tamar’s unique and established technologies deliver critical process control
metrology for flip-chip copper pillar bumping and other emerging applications

Business Wire

FLANDERS, N.J. -- April 29, 2013

Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process
characterization, photolithography equipment and software for the
semiconductor, FPD, LED and solar industries, announced today that it has
purchased selected assets, including a strong patent portfolio, relating to
metrology capability from Tamar Technology, Newbury Park, Calif. The addition
of Tamar’s advanced metrology technologies to Rudolph’s existing inspection
and metrology systems will allow the company to address the emerging need for
fast, precise three-dimensional (3D) measurement capabilities in the
rapidly-growing advanced packaging market sector.

Michael Jost, vice president and general manager of Rudolph’s Inspection
Business Unit, noted, “The purchase of these assets adds new capabilities to
our technology portfolio, which addresses an emerging need for 3D measurements
to control copper pillar bumping in advanced packaging processes. Tamar’s
unique technology is already well known and widely used. Integrating it into
our NSX^® and F30^™ inspection and metrology platforms adds critical
capability and value to an established and reliable tool set. Several
customers brought this exclusive technology to our attention; and it was
readily apparent that the acquisition of these assets would significantly
enhance the breadth of our advanced packaging solutions. In addition, this
purchase gives Rudolph a significant patent portfolio that we plan to fully
leverage. The integration work is essentially complete and we expect to
receive initial system orders in the coming months.”

David Grant, Tamar Technology’s president, commented, “We are pleased to be
joining forces with an industry leader like Rudolph. Our technology is well
recognized and already in use at a number of major manufacturers. This
agreement with Rudolph integrates our technology into an advanced platform
from a trusted supplier that meets our customers’ needs for throughput and
process integration in high-volume production.”

Jost added, “This acquisition aligns fully with our declared strategy to
leverage our front-end and back-end expertise in the burgeoning market for
advanced packaging process control. Copper pillar bumping for flip-chips has
been forecast to grow at a 35 percent CAGR from 2010 to 2018. While copper
pillar bumping processes are the most significant immediate application,
Tamar’s technology portfolio provides uniquely capable critical measurements
required in several advanced packaging applications. For example, one
application uses infrared light to measure TSV depth from the backside of the
wafer, thus avoiding the limitations on via aspect ratio encountered by most
frontside measurement approaches. We expect the addition of these unique and
proprietary capabilities to positively influence both unit volume and margins
while helping Rudolph to maintain our #1 market share position in this rapidly
growing sector.”

Terms of the transaction were not disclosed. However, the Company noted that
the asset purchase agreement includes an earn-out contingency that, if met,
would bring the total transaction value to approximately $10 million. The
company also noted that it expects the transaction to be accretive to earnings
within the first 12 months.

About Tamar Technology

Tamar Technology, based in Newbury Park, California, is a precision metrology
company specializing in systems for the semiconductor, hard disk drive and
medical device industries. For more information on Tamar Technology, visit
www.tamartechnology.com.

About Rudolph Technologies

Rudolph Technologies, Inc. is a worldwide leader in the design, development,
manufacture and support of defect inspection, advanced packaging lithography,
process control metrology, and data analysis systems and software used by
semiconductor device manufacturers worldwide. Rudolph provides a full-fab
solution through its families of proprietary products that provide critical
yield-enhancing information, enabling microelectronic device manufacturers to
drive down the costs and time to market of their products. The Company’s
expanding portfolio of equipment and software solutions is used in both the
wafer processing and final manufacturing of ICs, and in adjacent markets such
as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports
its customers with a worldwide sales and service organization. Additional
information can be found on the Company’s website at www.rudolphtech.com.

Safe Harbor Statement

This press release contains forward-looking statements within the meaning of
the Private Securities Litigation Reform Act of 1995 (the “Act”) which include
Rudolph’s business momentum and future growth; the benefits to customers of
Rudolph’s products; Rudolph’s ability to both deliver products and services
consistent with our customers’ demands and expectations and strengthen its
market position; Rudolph’s expectations regarding the company’s anticipated
revenue as a result of the acquisition; as well as other matters that are not
purely historical data. Rudolph wishes to take advantage of the “safe harbor”
provided for by the Act and cautions that actual results may differ materially
from those projected as a result of various factors, including risks and
uncertainties, many of which are beyond Rudolph’s control. Such factors
include, but are not limited to, the company’s ability to leverage its
resources to improve its position in its core markets; the businesses of
Rudolph and Tamar may not be integrated successfully, which may result in the
resultant business not operating as effectively and efficiently as expected or
such integration may be more difficult, time-consuming or costly than
expected; expected combination benefits from the acquisition may not be fully
realized or realized within the expected time frame; revenues following the
acquisition may be lower than expected; costs, customer loss and business
disruption, including, without limitation, difficulties in maintaining
relationships with employees, customers, clients or suppliers, may be greater
than expected following the consummation of the acquisition; or the businesses
of the companies may suffer as a result of uncertainty surrounding the
transaction. Additional information and considerations regarding the risks
faced by Rudolph are available in Rudolph’s Form 10-K report for the year
ended December 31, 2012 and other filings with the Securities and Exchange
Commission. As the forward-looking statements are based on Rudolph’s current
expectations, the company cannot guarantee any related future results, levels
of activity, performance or achievements. Rudolph does not assume any
obligation to update the forward-looking information contained in this press
release.

Contact:

Rudolph Technologies, Inc.
Investors:
Steven R. Roth, 973-448-4302
steven.roth@rudolphtech.com
or
Trade Press:
Amy Pauling, 952-259-1794
amy.pauling@rudolphtech.com
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