Micron's Hybrid Memory Cube Named Memory Product of the Year by EE Times and
BOISE, Idaho, April 24, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc.,
(Nasdaq:MU) announced today that its Hybrid Memory Cube was named the Memory
Product of the Year by a panel of industry experts.
ACE Awards logo
The award was announced this week at the EE Times and EDN ACE Awards Event at
Design West, the annual technical conference for electronics design engineers,
entrepreneurs and technology professionals. This year's awards mark a critical
juncture in the industry, as system designers across a broad range of
applications look for new memory system designs that will support increased
demands for bandwidth, density and power efficiency. Hybrid Memory Cube (HMC)
has been recognized by industry leaders and influencers as the long-awaited
answer to the growing gap between the performance improvement rate of DRAM
versus processor data consumption rate – a dilemma known as the "memory wall."
"Electronic Design News and EE Times are two of the industry's most
influential and well-read publications by design engineers and system
architects," said Brian Shirley, vice president of Micron's DRAM solutions
group. "We are honored that they share our vision for the unprecedented impact
and value that Hybrid Memory Cube brings to the electronics industry."
An industry breakthrough, HMC uses advanced through-silicon vias (TSVs) –
vertical conduits that electrically connect a stack of individual chips – to
combine high-performance logic with Micron's state-of-the-art DRAM chips. HMC
delivers bandwidth and efficiencies a leap beyond current device capabilities,
blasting data 15 times faster than a DDR3 module and using 70 percent less
energy and 90 percent less space than existing technologies. Micron expects to
ship the first engineering samples of this revolutionary technology later this
Micron Technology, Inc., is one of the world's leading providers of advanced
semiconductor solutions. Through its worldwide operations, Micron manufactures
and markets a full range of DRAM, NAND and NOR flash memory, as well as other
innovative memory technologies, packaging solutions and semiconductor systems
for use in leading-edge computing, consumer, networking, embedded and mobile
products. Micron's common stock is traded on the NASDAQ under the MU symbol.
To learn more about Micron Technology, Inc., visit www.micron.com.
©2013 Micron Technology, Inc. All rights reserved. Information is subject to
change without notice. Micron and the Micron orbit logo are trademarks of
Micron Technology, Inc. All other trademarks are the property of their
respective owners. This news release contains forward-looking statements
regarding the production of Hybrid Memory Cube. Actual events or results may
differ materially from those contained in the forward-looking statements.
Please refer to the documents Micron files on a consolidated basis from time
to time with the Securities and Exchange Commission, specifically Micron's
most recent Form 10-K and Form 10-Q. These documents contain and identify
important factors that could cause the actual results for Micron on a
consolidated basis to differ materially from those contained in our
forward-looking statements (see Certain Factors). Although we believe that the
expectations reflected in the forward-looking statements are reasonable, we
cannot guarantee future results, levels of activity, performance or
CONTACT: Micron Media Contact:
Micron Technology, Inc.
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