The Future of Thermal Mitigation Technology Showcased at Advancements in Thermal Management 2013 Conference Business Wire GREENWOOD VILLAGE, Colo. -- April 24, 2013 From supercomputers to tablets, increased processing power is a must for devices to keep pace with the modern world. With these ever-evolving CPUs comes the need to keep them cool and operational. That is why the Advancements in Thermal Management conference is coming back to Denver, Colo. on June 6^th – 7^th 2013. This event will feature educational presentations and focused exhibits on the latest technology for managing temperature in electronics, including cooling, thermal imaging, temperature sensing and control, thermal interface materials and board level heating technology. This technical conference is specifically tailored for engineers, material scientists, CTOs, R&D managers and product developers designing new products and looking for best ways to mitigate temperature in their applications. If your products and services depend upon sophisticated and precise control of thermal properties and states, this is your must attend event of the year. “With ever increasing processing power in electronic devices, the need for more advanced thermal management technology has become a priority for everyone involved in the design of these products,” said Nick Depperschmidt, conference chairman, Advancements in Thermal Management 2013. “That is why we’ve brought together some of the brightest minds in the industry to discuss the latest thermal management technology and solutions.” The technical program includes two days of educational presentations. Participating companies and organizations include DARPA, University of Arkansas, Sapa Extrusions North America, Degree Controls, Shin-Etsu Chemical Co., Arlon Silicone Technologies, University of California-Riverside (UCR), C-Therm Technologies Ltd., and many more. Advancements in Thermal Management 2013 will also be co-located with Battery Power 2013. The shared exhibit hall and networking functions with Battery Power will afford Thermal Conference attendees the ability to gain new clients in the battery markets, which are desperate for more advanced thermal management innovations for their devices and platforms. Contact: Webcom Communications, Inc. Nick Depperschmidt, 720-528-3770 x 111 Nickd@WebcomCommunications.com @ThermalShow
The Future of Thermal Mitigation Technology Showcased at Advancements in Thermal Management 2013 Conference
Press spacebar to pause and continue. Press esc to stop.