The Future of Thermal Mitigation Technology Showcased at Advancements in Thermal Management 2013 Conference

  The Future of Thermal Mitigation Technology Showcased at Advancements in
  Thermal Management 2013 Conference

Business Wire

GREENWOOD VILLAGE, Colo. -- April 24, 2013

From supercomputers to tablets, increased processing power is a must for
devices to keep pace with the modern world. With these ever-evolving CPUs
comes the need to keep them cool and operational. That is why the Advancements
in Thermal Management conference is coming back to Denver, Colo. on June 6^th
– 7^th 2013. This event will feature educational presentations and focused
exhibits on the latest technology for managing temperature in electronics,
including cooling, thermal imaging, temperature sensing and control, thermal
interface materials and board level heating technology.

This technical conference is specifically tailored for engineers, material
scientists, CTOs, R&D managers and product developers designing new products
and looking for best ways to mitigate temperature in their applications. If
your products and services depend upon sophisticated and precise control of
thermal properties and states, this is your must attend event of the year.

“With ever increasing processing power in electronic devices, the need for
more advanced thermal management technology has become a priority for everyone
involved in the design of these products,” said Nick Depperschmidt, conference
chairman, Advancements in Thermal Management 2013. “That is why we’ve brought
together some of the brightest minds in the industry to discuss the latest
thermal management technology and solutions.”

The technical program includes two days of educational presentations.
Participating companies and organizations include DARPA, University of
Arkansas, Sapa Extrusions North America, Degree Controls, Shin-Etsu Chemical
Co., Arlon Silicone Technologies, University of California-Riverside (UCR),
C-Therm Technologies Ltd., and many more.

Advancements in Thermal Management 2013 will also be co-located with Battery
Power 2013. The shared exhibit hall and networking functions with Battery
Power will afford Thermal Conference attendees the ability to gain new clients
in the battery markets, which are desperate for more advanced thermal
management innovations for their devices and platforms.

Contact:

Webcom Communications, Inc.
Nick Depperschmidt, 720-528-3770 x 111
Nickd@WebcomCommunications.com
@ThermalShow