Hermes Testing Solution Inc. and Invensas Corporation Enter Into Long-term Technology and Patent Licensing Agreement

  Hermes Testing Solution Inc. and Invensas Corporation Enter Into Long-term
  Technology and Patent Licensing Agreement

COMPUTEX TAIPEI 2013

Business Wire

SAN JOSE, Calif. -- April 16, 2013

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc.
(Nasdaq: TSRA), announced today that Hermes Testing Solution Inc., a
subsidiary of Hermes Group and a leading semiconductor manufacturing and
services company headquartered in Taiwan, has signed a long-term license
agreement to manufacture and sell xFD^TM based products into the tablet,
mobile computing, and data storage markets.

“We are delighted that Hermes has chosen to license our xFD technology
portfolio in response to demand from original equipment manufacturers (OEMs)
and original design manufacturers (ODMs),” said Simon McElrea, president of
Invensas. “Having already licensed xFD at the OEM demand level and memory chip
supply level in the first quarter of this year, our next step was to enable
the manufacturing and supply chain integration base. Hermes’ location in
Taiwan, its broad slate of customers, and its established network of Asian
supply chain partners made it a perfect candidate.”

“xFD is well aligned with Hermes’ business model of providing high value-added
products and services to the semiconductor industry,” said William Wang, GM of
Hermes Testing Solution. “The technology enables much smaller and higher
performance devices to be built for important growth markets, such as tablets,
mobile devices, and next generation servers. These markets require not only
breakthrough products, but innovative test and integration solutions, and that
is Hermes strength.”

Hermes Group and Hermes Testing Solution are headquartered in Hsinshu, Taiwan
with facilities in Singapore, Malaysia and China.

Invensas and its partners will be demonstrating xFD-based products this
quarter at the Intel Developer Forum, Beijing (April 2013), ECTC, Las Vegas
(May 2013), and Computex, Taiwan (June 2013), among other events. See
www.invensas.com for details.

Safe Harbor Statement

This press release contains forward-looking statements, which are made
pursuant to the safe harbor provisions of the Private Securities Litigation
Reform Act of 1995. Forward-looking statements involve risks and uncertainties
that could cause actual results to differ significantly from those projected,
particularly with respect to the effects and duration of the license agreement
with Hermes Testing Solution Inc., the characteristics, features and benefits
of the xFD technology, and the participation by Invensas at upcoming events,
including the Intel Developer Forum, ECTC, Las Vegas, and Computex, Taiwan,
and the subject matter of the presentations by Invensas at such events.
Material factors that may cause results to differ from the statements made
include the plans or operations relating to the businesses; market or industry
conditions of Tessera Technologies, Inc. (the “Company”); changes in patent
laws, regulation or enforcement, or other factors that might affect the
Company’s ability to protect or realize the value of its intellectual
property; the expiration of license agreements and the cessation of related
royalty income; the failure, inability or refusal of licensees to pay
royalties; initiation, delays, setbacks or losses relating to the Company’s
intellectual property or intellectual property litigations, or invalidation or
limitation of key patents; the timing and results, which are not predictable
and may vary in any individual proceeding, of any ICC ruling or award,
including in the Amkor arbitration; fluctuations in operating results due to
the timing of new license agreements and royalties, or due to legal costs; the
risk of a decline in demand for semiconductor and camera module products;
failure by the industry to use technologies covered by the Company’s patents;
the expiration of the Company's patents; the Company's ability to successfully
complete and integrate acquisitions of businesses; the risk of loss of, or
decreases in production orders from, customers of acquired businesses;
financial and regulatory risks associated with the international nature of the
Company’s businesses; failure of the Company’s products to achieve
technological feasibility or profitability; failure to successfully
commercialize the Company's products; changes in demand for the products of
the Company’s customers; limited opportunities to license technologies and
sell products due to high concentration in the markets for semiconductors and
related products and camera modules; the impact of competing technologies on
the demand for the Company’s technologies and products; and the reliance on a
limited number of suppliers for the components used in the manufacture of DOC
products. You are cautioned not to place undue reliance on the forward-looking
statements, which speak only as of the date of this release. The Company’s
filings with the Securities and Exchange Commission, including its Annual
Report on Form 10-K for the year ended Dec. 31, 2012, include more information
about factors that could affect the Company’s financial results. The Company
assumes no obligation to update information contained in this press release.
Although this release may remain available on the Company’s website or
elsewhere, its continued availability does not indicate that the Company is
reaffirming or confirming any of the information contained herein.

About Invensas Corporation

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc.
(Nasdaq: TSRA - News), is a global leader in semiconductor interconnect
solutions and intellectual property. Invensas innovates in areas such as
mobile computing and communications, memory and data storage, and 3-D
Integrated Circuit (3DIC) technologies. Headquartered in San Jose, California,
Invensas licenses these solutions to Original Equipment Makers, Original
Design Manufacturers, and Integrated Device Manufactures and delivers the
products to market through collaborative engineering partnerships and
strategic business alliances. Learn more at www.interconnectology.com or
www.invensas.com, or contact Invensas PR at +1 408 324 5105.

TSRA-G

Contact:

Invensas Corporation
Rick Neely, 408-321-6756
Chief Financial Officer
or
PR Contact:
Impress Labs
Amy Smith, 401-369-9266
amy@impresslabs.com