Altera and TSMC Collaborate on 55 nm EmbFlash Process
Altera Plans Next-Generation, Non-Volatile Programmable Devices Targeting
SAN JOSE, Calif. and HSINCHU, Taiwan, April 15, 2013
SAN JOSE, Calif. and HSINCHU, Taiwan, April 15, 2013 /PRNewswire/ -- Altera
Corporation (Nasdaq: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced a
technology collaboration using TSMC's 55 nm leading-edge Embedded Flash
(EmbFlash) process technology. Programmable devices based on TSMC's 55 nm
EmbFlash target a wide range of low-power, high-volume applications in a
variety of markets, including automotive and industrial.
Compared to prior generation embedded flash, TSMC's 55 nm EmbFlash delivers
faster computing, increases gate density 10 times and shrinks flash and SRAM
cell sizes by 70 percent and 80 percent respectively. Programmable devices
from Altera based on TSMC's 55 nm EmbFlash will permit developers of
high-volume applications to build feature-rich, non-volatile systems.
"Our relationship with TSMC is built on a shared commitment to delivering the
latest technologies and capabilities to customers," said Reda Razouk, vice
president of process technology development at Altera. "Adding 55 nm EmbFlash
to our product portfolio extends Altera's tailored strategy in which Altera
optimizes its device families based on process technology, architecture and
application-specific IP to meet system requirements."
"TSMC's continued investment in technologies such as 55 nm EmbFlash broadens
opportunities for customers like Altera," said Jason Chen, TSMC senior vice
president, worldwide sales and marketing. "By aligning our business and
technology goals, Altera can make its customers' products more competitive."
Altera® programmable solutions enable system and semiconductor companies to
rapidly and cost effectively innovate, differentiate and win in their markets.
Find out more about Altera's FPGAs, SoCs, CPLDs and ASICs at www.altera.com.
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TSMC is the world's largest dedicated semiconductor foundry, providing the
industry's leading process technology and the foundry segment's largest
portfolio of process-proven libraries, IPs, design tools and reference flows.
The Company's managed capacity in 2012 totaled 15.1 million (8-inch
equivalent) wafers, including capacity from three advanced 12-inch GIGAFAB™
facilities, four eight-inch fabs, one six-inch fab, as well as TSMC's wholly
owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC.
TSMC is the first foundry to provide 28nm production capabilities. TSMC's
corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC
please visit http://www.tsmc.com.
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words and logos are trademarks of Altera Corporation and registered in the
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Steve Gabriel Elizabeth Sun
Altera Corporation TSMC
(408) 544-6846 886-3-5682085
SOURCE Altera Corporation
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