Toshiba Starts Volume Production of SiC Power Devices Silicon Carbide Lineup Will Meet Demand for Industrial and Automotive Applications PR Newswire IRVINE, Calif., April 11, 2013 IRVINE, Calif., April 11, 2013 /PRNewswire/ --Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, has announced that Toshiba Corporation has started volume production of silicon carbide (SiC) power devices, in anticipation of growing demand for industrial and automotive applications. Production is at Toshiba's Himeji Operations–Semiconductor in Hyogo Prefecture, Japan. Toshiba will manufacture Schottky Barrier Diodes (SBDs) as the first of its new line-up of SiC products. The SBD is suited for applications that include power conditioners for photovoltaic power generation systems. SBDs can also act as replacements for silicon diodes in switching power supplies, where they are approximately 50 percent more efficient. SiC power devices offer more stable operation than current silicon devices - even at high voltages and currents - as they significantly reduce heat dissipation during operation. They meet diverse industry needs for smaller, more effective communications devices and suit industrial applications ranging from servers to inverters and trains to automotive systems. Analysts estimate that the SiC power device market will grow to about 10 times the current scale by 2020. Toshiba aims to secure 30 percent market share in 2020 by strengthening its product line-up, starting with the launch of the new SBD. Initial Product Specifications: Part number TRS12E65C V[RRM] 650V I[FM] 12A V[F] 1.7V max@I[F]=12A I[RRM] 90uA max@[VRRM]=650V Timing of volume production March 2013 Scale of production 1 million pieces *About Toshiba Corp. and TAEC Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide.A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, MP3 players, cameras, medical devices, automotive electronics, enterprise solutions and more. Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2011 Worldwide Semiconductor Revenue, March, 2012). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm. © 2013 Toshiba America Electronic Components, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. Editor's Note: Images available for download from: http://www.toshiba.com/taec/news/press_releases/2013/powr_13_673.jsp MEDIA CONTACT: Dena Jacobson Lages & Associates Tel.: (949) 453-8080 firstname.lastname@example.org SOURCE Toshiba America Electronic Components, Inc. Website: http://www.toshiba.com/taec Contact: Rebecca Bueno, Toshiba America Electronic Components, Inc., (949) 623-3099, email@example.com
Toshiba Starts Volume Production of SiC Power Devices
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