Toshiba Starts Volume Production of SiC Power Devices
Silicon Carbide Lineup Will Meet Demand for Industrial and Automotive
IRVINE, Calif., April 11, 2013
IRVINE, Calif., April 11, 2013 /PRNewswire/ --Toshiba America Electronic
Components, Inc., (TAEC)*, a committed leader that collaborates with
technology companies to create breakthrough designs, has announced that
Toshiba Corporation has started volume production of silicon carbide (SiC)
power devices, in anticipation of growing demand for industrial and automotive
applications. Production is at Toshiba's Himeji Operations–Semiconductor in
Hyogo Prefecture, Japan.
Toshiba will manufacture Schottky Barrier Diodes (SBDs) as the first of its
new line-up of SiC products. The SBD is suited for applications that include
power conditioners for photovoltaic power generation systems. SBDs can also
act as replacements for silicon diodes in switching power supplies, where they
are approximately 50 percent more efficient.
SiC power devices offer more stable operation than current silicon devices -
even at high voltages and currents - as they significantly reduce heat
dissipation during operation. They meet diverse industry needs for smaller,
more effective communications devices and suit industrial applications ranging
from servers to inverters and trains to automotive systems.
Analysts estimate that the SiC power device market will grow to about 10 times
the current scale by 2020. Toshiba aims to secure 30 percent market share in
2020 by strengthening its product line-up, starting with the launch of the new
Initial Product Specifications:
Part number TRS12E65C
V[F] 1.7V max@I[F]=12A
I[RRM] 90uA max@[VRRM]=650V
Timing of volume production March 2013
Scale of production 1 million pieces
*About Toshiba Corp. and TAEC
Through proven commitment, lasting relationships and advanced, reliable
electronic components, Toshiba enables its customers to create market-leading
designs. Toshiba is the heartbeat within product breakthroughs from OEMs,
ODMs, CMs, VARs, distributors and fabless chip companies worldwide.A
committed electronic components leader, Toshiba designs and manufactures
high-quality flash memory-based storage solutions, solid state drives (SSDs),
hard disk drives (HDDs), discrete devices, advanced materials, medical tubes,
custom SoCs/ASICs, imaging products, microcontrollers and wireless components
that make possible today's leading smartphones, tablets, MP3 players, cameras,
medical devices, automotive electronics, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating
company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation,
Japan's largest semiconductor manufacturer and the world's third largest
semiconductor manufacturer (Gartner, 2011 Worldwide Semiconductor Revenue,
March, 2012). Toshiba Corporation was founded in 1875 and today has over 554
subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's
web site at www.toshiba.co.jp/index.htm.
© 2013 Toshiba America Electronic Components, Inc. All rights reserved.
Information in this press release, including product pricing and
specifications, content of services and contact information, is current and
believed to be accurate on the date of the announcement, but is subject to
change without prior notice. Technical and application information contained
here is subject to the most recent applicable Toshiba product specifications.
Editor's Note: Images available for download from:
Lages & Associates
Tel.: (949) 453-8080
SOURCE Toshiba America Electronic Components, Inc.
Contact: Rebecca Bueno, Toshiba America Electronic Components, Inc., (949)
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