Rudolph Technologies Schedules 2013 First Quarter Earnings Conference Call
for May 2, 2013
FLANDERS, N.J. -- April 10, 2013
Rudolph Technologies, Inc. (Nasdaq:RTEC), a leading provider of process
characterization equipment and software for wafer fabs and advanced packaging
facilities, will release results for the 2013 first quarter, after the market
closes on Thursday, May 2, 2013. In conjunction with this release, Rudolph
will host a conference call, which will be broadcast live over the Internet.
Paul F. McLaughlin, Chairman and Chief Executive Officer, and Steven Roth,
Chief Financial Officer will host the call. The call will take place:
May 2, 2013
4:30 PM (EDT)
To participate in the call, please dial (888) 603-6873 (Domestic) and (973)
582-2706 (International), reference Conference ID #35291129 at least five (5)
minutes prior to the scheduled start time. A live webcast will also be
available on the Company’s website at www.rudolphtech.com
To listen to the live webcast, please go to the website at least fifteen (15)
minutes early to register, download and install any necessary audio software.
There will be a replay of the conference call available from 5:30pm EDT on May
2 until 11:59pm EDT on May 9, 2013. To access the replay, please dial
855-859-2056 (Domestic) or 404-537-3406 (International) at any time during
that period and use Conference ID 35291129.
A replay will also be available on the Company’s website at
About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development,
manufacture and support of defect inspection, advanced packaging lithography,
process control metrology, and data analysis systems and software used by
semiconductor device manufacturers worldwide. Rudolph provides a full-fab
solution through its families of proprietary products that provide critical
yield-enhancing information, enabling microelectronic device manufacturers to
drive down the costs and time to market of their products. The Company’s
expanding portfolio of equipment and software solutions is used in both the
wafer processing and final manufacturing of ICs, and in adjacent markets such
as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports
its customers with a worldwide sales and service organization. Additional
information can be found on the Company’s website at www.rudolphtech.com.
Rudolph Technologies, Inc.
Steven R. Roth, 973-448-4302
Senior Vice President & CFO
Laura Guerrant-Oiye, 808-882-1467
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