TI introduces industry's first Full HD image sensor receiver

         TI introduces industry's first Full HD image sensor receiver

1080p60 sensor-to-processor IC reduces video system size and power consumption

PR Newswire

DALLAS, April 3, 2013

DALLAS, April 3, 2013 /PRNewswire/ -- Texas Instruments Incorporated (TI)
(NASDAQ: TXN) today introduced the industry's first image sensor receiver IC
to serve as a dedicated LVDS bridge between image sensors and processors.
Compared to existing FPGA-based solutions, the SN65LVDS324 lowers the
bill-of-materials (BOM) by 20 percent, reduces system power consumption by
more than 10 percent and shrinks package size by 50 percent. It provides full
HD, 1080p60 image quality in a host of video capture applications, including
surveillance IP cameras and video conferencing systems, as well as industrial,
consumer and professional video recording equipment. For more information and
to order samples, visit www.ti.com/sn65lvds324-pr.

Key features and benefits of the SN65LVDS324

  oOptimized solution for sensor-to-processor interface: As a dedicated
    bridge for video streams between HD image sensors and processors, the
    SN65LVDS324 lowers BOM costs by up to 20 percent compared to existing
    FPGA-based solutions.
  oDedicated sensor-to-processor interface: In 1080p60 system
    implementations, the SN65LVDS324 typically consumes less than 150 mW,
    reducing system power consumption by more than 10 percent versus current
    FPGA solutions.
  oSmallest package size: Dedicated function provides a 50-percent smaller
    package than current FPGAs.
  oExcellent video resolution: Supports a wide range of resolutions and frame
    rates, up to 1080p60-full-HD to maximize system performance.

The SN65LVDS324 is an extension of TI's popular FlatLink™ and FlatLink™3G
serial interface technology, which reduces the number of signal lines used for
synchronous parallel data bus structures with no loss in data throughput. It
is also optimized to work with a variety of processors, including TI's OMAP™
and DaVinci™ processors for video applications.

Availability, packaging and pricing

The SN65LVDS324 is available in a 4.5-mm by 7-mm, 59-ball PBGA (ZQL) package.
Suggested retail pricing in 1000-unit quantities is US$2.65.

Learn more about TI's FlatLink 3G portfolio by visiting the links below:

  oOrder SN65LVDS324 samples: www.ti.com/sn65lvds324s-pr.
  oView the SN65LVDS324 video.
  oDownload theSN65LVDS324 datasheet.
  oEngineers designing with the SN65LVDS324 can also ask questions and get
    answers from TI experts in the TI E2E™ Interface Community.
  oFollow what TI signal chain experts have to say on our blog: Analog Wire.

About Texas Instruments

Texas Instruments semiconductor innovations help 90,000 customers unlock the
possibilities of the world as it could be – smarter, safer, greener, healthier
and more fun. Our commitment to building a better future is ingrained in
everything we do – from the responsible manufacturing of our semiconductors,
to caring for our employees, to giving back inside our communities. This is
just the beginning of our story. Learn more at www.ti.com.


TI E2E, FlatLink, FlatLink3G, DaVinci and OMAP are trademarks of Texas
Instruments. All other trademarks and registered trademarks belong to their
respective owners.

(Photo: http://photos.prnewswire.com/prnh/20130403/DA87896-INFO)

SOURCE Texas Instruments Incorporated

Website: http://www.ti.com
Contact: Lindsey Starnes, Texas Instruments, 214-479-3325, lindsey@ti.com; or
Vicky Smithee, GolinHarris, 972-341-2537, vsmithee@golinharris.com (Please do
not publish these numbers or e-mail addresses.)
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