Spectra7 Announces Appointment Of Dr. Andrew Kim As CTO

Respected Ph.D. in Signal Processing from MIT Brings Proven Innovation 
PALO ALTO, Calif. and TORONTO, April 3, 2013 /CNW/ - (TSX-V:SEV) Spectra7 
Microsystems Inc. ("Spectra7"), a high performance analog semiconductor 
company delivering unprecedented speed, resolution and signal fidelity to 
consumer and wireless infrastructure products, officially welcomed Dr. Andrew 
Kim as Chief Technology Officer. 
"We're delighted and honored to welcome Dr. Kim to the team," commented Tony 
Stelliga, CEO of Spectra7. "He's considered one of the great minds in signal 
processing and his expertise has already resulted in new patent pending 
techniques to deliver bandwidth at game-changing speeds and resolution." 
Prior to joining Spectra7, Dr. Kim was a Senior Principal Systems Engineer at 
Intersil Corp. where he was instrumental in creating new system architectures 
and processing blocks for high-speed wireline products. Prior to that, he was 
a Senior Engineer at Samsung Electro-Mechanics Co. Ltd from 2008 to 2010 where 
he developed RF signal integrity solutions for spectrum sensing and 
interference cancellation applications. From 2001 to 2008, he was a Senior 
Systems Architect at Quellan Inc. where he developed signal integrity 
solutions for both wired and wireless high-speed channels. 
Dr. Kim received his Ph.D. from the Massachusetts Institute of Technology for 
work in signal processing based on stochastic analysis. He has 21 granted 
patents and 10 pending in the field of signal integrity. 
"It's well known throughout the industry there's a paradigm shift coming," 
commented Dr. Kim. "The increasing bandwidth and speeds required to deliver 
pristine content is set to overwhelm today's infrastructure and those 
organizations able to solve this dilemma will define the next generation of 
semiconductor companies." 
Spectra7 Microsystems Inc. (TSX-V: SEV) is a high performance analog 
semiconductor company delivering unprecedented speed, resolution and signal 
fidelity to consumer and wireless infrastructure products. Spectra7's new 
system level components address the bottlenecks and the exponential demand for 
more bandwidth and lower costs in mobile and internet infrastructure 
equipment, including handsets, tablets, base stations and microwave backhaul 
systems. For more information, please visit http://www.spectra7.com 
Certain information in this news release may constitute forward-looking 
information. This information is based on current expectations that are 
subject to significant risks and uncertainties that are difficult to predict. 
Actual results might differ materially from results suggested in any 
forward-looking statements. Spectra7 assumes no obligation to update the 
forward-looking statements, or to update the reasons why actual results could 
differ from those reflected in the forward looking-statements unless and until 
required by securities laws applicable to Spectra7.  Additional information 
identifying risks and uncertainties is contained in Spectra7's filings with 
the Canadian securities regulators available at www.sedar.com. 
Neither the TSX-V nor its Regulation Services Provider (as that term is 
defined in the policies of the TSX-V) accepts responsibility for the adequacy 
or accuracy of this release. 
Robert Munro, Communications, +1-905-480-9109, ext. 269, pr@spectra7.com 
SOURCE: Spectra7 Microsystems Inc. 
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CO: Spectra7 Microsystems Inc.
ST: Ontario
-0- Apr/03/2013 13:16 GMT
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