Ferrotec Temescal Unveils Ultra-Efficient Fast Cycle Electron Beam
Metallization System for Compound Semiconductor Applications
New UEFC-5700 with Auratus™ Deposition Process Enhancement Methodology Enables
Unprecedented Production Uniformity and Material Collection Efficiency
LIVERMORE, Calif., April 2, 2013
LIVERMORE, Calif., April 2, 2013 /PRNewswire/ -- The Temescal Division of
Ferrotec Corporation, a global supplier of materials, components, and
precision system solutions and the leading manufacturer of electron beam
evaporation systems, today announced the Temescal UEFC-5700, a ultra-high
efficiency electron beam metallization system for lift-off compound
semiconductor applications. The UEFC-5700 is the first Temescal system to
incorporate the Auratus^™ Deposition Process Enhancement Methodology, offering
near-perfect uniformity while delivering up to 40% increases in material
collection efficiency, resulting in significant cost savings on process
materials like gold and platinum compared to traditional box coaters.
The Temescal UEFC-5700 is designed for compound semiconductor production
environments that use lift-off electron beam evaporation processes. The
UEFC-5700 features a unique conical shaped vacuum chamber that reduces volume
and surface area, significantly reducing pump-down time. The system also
features a patent-pending High-Uniformity Lift-off Assembly (HULA) design that
uses a dual-axis motion to optimize collection efficiency.
"With the UEFC-5700, we have significantly improved the throughput efficiency
of traditional lift-off coating processes. From the unique chamber design to
the HULA carrier system, the UEFC-5700 improves pumping and batch capacity
with excellent uniformity across all evaporated materials, enabling the system
to run more wafers and more batches per day than any conventional box coater,"
said Gregg Wallace, managing director of Ferrotec's Temescal division. "The
biggest benefit to users of this system is the improvement in uniformity and
collection efficiency of all materials being evaporated. For IDMs and
foundries, this equates to improved yields of better devices that cost much
less to produce. "
The Temescal UEFC-5700 offers increased wafer production capacity, up to
forty-two 150mm wafers in a batch, without a significant change in raw
material or energy consumption. In terms of footprint and power consumption,
the UEFC-5700 is virtually identical to the FC-4400 system, Temescal's largest
With its unique conical shaped load-locked chamber and 44,000 liters/second of
installed cryogenic pumping capacity, the UEFC-5700 reaches process pressures
significantly faster than most conventional box coaters. Systems have reached
5E-07 Torr in under 10 minutes, improving production cycle times and the
number of batches that can be run per shift or day.
The system incorporates Temescal's Auratus deposition process enhancement
methodology. Auratus is a patent-pending proprietary optimization methodology
for lift-off electron beam evaporative coating that incorporates patent
pending technology to achieve unprecedented levels of uniformity, precision,
and collection efficiency.
More information about the UEFC-5700, Auratus and other Temescal products can
be found at www.temescal.net.
More About Ferrotec
Founded in 1980, Ferrotec Corporation (JASDAQ: 6890 (OTC)) is a worldwide
leader in the supply of materials, components, and precision system solutions
for businesses and products. Ferrotec's Temescal division is the leading
manufacturer of electron beam-based evaporative coating systems. For
additional information about Ferrotec products, visit the company's web site
PR Contact: Tom McKee
Marketing Communications Manager
SOURCE Ferrotec Corporation
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