Toshiba Announces Thinnest Camera Module With High Resolution, 13 Mega Pixel, Image Sensor For Top-Quality Pictures

Toshiba Announces Thinnest Camera Module With High Resolution, 13 Mega Pixel,
                    Image Sensor For Top-Quality Pictures

New Camera Module Will Drive Next-Generation, Ultra-Thin Smartphones and

PR Newswire

SAN JOSE, Calif., April 2, 2013

SAN JOSE, Calif., April 2, 2013 /PRNewswire/ -- Toshiba America Electronic
Components, Inc. (TAEC)*, a committed leader that collaborates with technology
companies to create breakthrough designs, today announces the industry's
thinnest CMOS image sensor camera module with high-resolution, 13 mega pixel
(MP), imaging ideal for next-generation, ultra-thin smartphones and tablet
devices. The new TCM9930MD leverages an advanced image pre-processing LSI
(companion) chip and a refined module structure to create a compact image
sensor camera module with the industry's lowest profile at just 4.7 mm in

Achieving today's high-resolution CMOS image sensors requires a larger optical
size for corresponding lenses which results in a thicker camera module and a
bulkier mobile device. The conventional method for lowering the camera module
height is to modify the optical lens design which becomes problematic due to
resolution drop around the corners of the image area. The TCM9930MD, however,
resolves this drop in resolution with the use of the image pre-processing LSI
(companion) chip that provides distortion correction and performs image
resolution reconstruction [ ]^(1). Additionally, the TCM9930MD achieves its
low profile by using a flip-chip structurefor the image sensor. Toshiba opted
to use flip-chip packaging because it allows for a large number of
interconnects, with shorter distances than wire, which greatly reduces
assembling area and package height.

"Toshiba once again proves its technical expertise in the development of this
ultra-low height module enabling customers to create the thin, attractive
mobile products that consumers have come to expect," says Andrew Burt, vice
president of the Analog and Imaging Business Unit, System LSI Group at TAEC.
"Our strategy of continuous innovation and enhancement to the TAEC systems
offering, especially for the camera/imaging markets, provides the technology
solutions that will drive thinner mobile devices without compromising picture
quality or performance."

Pricing and Availability
Sample pricing for the TCM9930MD camera module is set at $80 (U.S.). The
TCM9930MD is expected to be available in sample quantities by May 2013.

About TAEC
Through proven commitment, lasting relationships and advanced, reliable
electronic components, Toshiba enables its customers to create market-leading
designs. Toshiba is the heartbeat within product breakthroughs from OEMs,
ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A
committed electronic components leader, Toshiba designs and manufactures
high-quality flash memory-based storage solutions, solid state drives (SSDs),
hard disk drives (HDDs), discrete devices, advanced materials, medical tubes,
custom SoCs/ASICs, imaging products, microcontrollers and wireless components
that make possible today's leading smartphones, tablets, MP3 players, cameras,
medical devices, automotive electronics, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating
company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation,
Japan's largest semiconductor manufacturer and the world's fifth largest
semiconductor manufacturer (Gartner, 2012 WW Semiconductor Preliminary Revenue
Ranking, December, 2012). Toshiba Corporation was founded in 1875 and today
has over 554 subsidiaries and affiliates, with 210,000 employees worldwide.
Visit Toshiba's web site at

Information in this press release, including product pricing and
specifications, content of services and contact information, is current and
believed to be accurate on the date of the announcement, but is subject to
change without prior notice. Technical and application information contained
here is subject to the most recent applicable Toshiba product specifications.
In developing designs, please ensure that Toshiba products are used within
specified operating ranges as set forth in the most recent Toshiba product
specifications and the information set forth in Toshiba's "Handling Guide for
Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This
information is available at or from your TAEC

    Resolution reconstruction adopted for this new product is a
(1) super-reconstruction technology developed by Toshiba corporate research
    and development center.

Nancy Sheffield    Deborah Chalmers
Acclaim Communications      Toshiba America Electronic Components, Inc.
Tel.: (408) 410-9928    Tel.: (408) 526-2454

SOURCE Toshiba America Electronic Components, Inc.

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