STMicroelectronics : STMicroelectronics Signs Loan Agreement with the European Investment Bank

STMicroelectronics : STMicroelectronics Signs Loan Agreement with the European
                               Investment Bank

PR N° C2710C

                   STMicroelectronics Signs Loan Agreement
                      with the European Investment Bank

  *Euro 350 million multicurrency facility supports ST's R&D investments in
    Power, MEMS and Sensors, Microcontrollers, Advanced Analog and Healthcare
    high-growth applications

  *Euro 350 million floating-rate senior bonds repaid on March 17^th with
    available resources 

  *ST capital structure further strengthened

Geneva, March 26, 2013 - STMicroelectronics (NYSE:STM), a global semiconductor
leader serving customers across the spectrum of electronics applications, has
signed a new Euro 350 million loan agreement with the European Investment Bank
(EIB). The facility, which has not yet been drawn by ST, is also available in
the US$ equivalent amount and has an option for disbursement until September
2014 with final maturity eight years after disbursement.

This new facility, which further strengthens the long-established relationship
between ST and EIB, supports ST's activities in R&D and innovation related to
the design and realization of the next generation of technologies and
electronic devices for applications in Power, MEMS, Microcontrollers, Advanced
Analog and Healthcare. This includes the full cycle from technology R&D and
product development to application solutions that include software development
and systems integration. These activities are mainly carried out in ST's
Italian sites of Agrate Brianza, Castelletto and Catania.

Furthermore, on March 17^th, 2013, ST repaid with available cash the residual
Euro 350 million floating-rate senior bonds outstanding with a principal
amount of Euro 500 million at issuance. ST's capital structure, already
supported by a net cash position of about US$ 1.19 billion at the end of Q4
2012, and existing committed credit lines for about US$ 490 million, has been
further strengthened by this new credit facility from the EIB.

About STMicroelectronics

ST is a global leader in the semiconductor market serving customers across the
spectrum of sense and power and automotive products and embedded processing
solutions. From energy management and savings to trust and data security, from
healthcare and wellness to smart consumer devices, in the home, car and
office, at work and at play, ST is found everywhere microelectronics make a
positive and innovative contribution to people's life. By getting more from
technology to get more from life, ST stands for life.augmented.
In 2012, the Company's net revenues were $8.49 billion. Further information on
ST can be found at www.st.com

For further information, please contact:

INVESTOR RELATIONS:
Tait Sorensen    
Group VP, Investor Relations
STMicroelectronics
Tel: +1 602 485 2064
tait.sorensen@st.com

MEDIA RELATIONS:
Nelly Dimey    
Director, Corporate Media and Public Relations
STMicroelectronics
Tel: +33 1 58 07 77 85
nelly.dimey@st.com

ST EIB Loan Agreement

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Source: STMicroelectronics via Thomson Reuters ONE
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