STMicroelectronics : STMicroelectronics Signs Loan Agreement with the European Investment Bank PR N° C2710C STMicroelectronics Signs Loan Agreement with the European Investment Bank *Euro 350 million multicurrency facility supports ST's R&D investments in Power, MEMS and Sensors, Microcontrollers, Advanced Analog and Healthcare high-growth applications *Euro 350 million floating-rate senior bonds repaid on March 17^th with available resources *ST capital structure further strengthened Geneva, March 26, 2013 - STMicroelectronics (NYSE:STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has signed a new Euro 350 million loan agreement with the European Investment Bank (EIB). The facility, which has not yet been drawn by ST, is also available in the US$ equivalent amount and has an option for disbursement until September 2014 with final maturity eight years after disbursement. This new facility, which further strengthens the long-established relationship between ST and EIB, supports ST's activities in R&D and innovation related to the design and realization of the next generation of technologies and electronic devices for applications in Power, MEMS, Microcontrollers, Advanced Analog and Healthcare. This includes the full cycle from technology R&D and product development to application solutions that include software development and systems integration. These activities are mainly carried out in ST's Italian sites of Agrate Brianza, Castelletto and Catania. Furthermore, on March 17^th, 2013, ST repaid with available cash the residual Euro 350 million floating-rate senior bonds outstanding with a principal amount of Euro 500 million at issuance. ST's capital structure, already supported by a net cash position of about US$ 1.19 billion at the end of Q4 2012, and existing committed credit lines for about US$ 490 million, has been further strengthened by this new credit facility from the EIB. About STMicroelectronics ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people's life. By getting more from technology to get more from life, ST stands for life.augmented. In 2012, the Company's net revenues were $8.49 billion. Further information on ST can be found at www.st.com For further information, please contact: INVESTOR RELATIONS: Tait Sorensen Group VP, Investor Relations STMicroelectronics Tel: +1 602 485 2064 firstname.lastname@example.org MEDIA RELATIONS: Nelly Dimey Director, Corporate Media and Public Relations STMicroelectronics Tel: +33 1 58 07 77 85 email@example.com ST EIB Loan Agreement ------------------------------------------------------------------------------ This announcement is distributed by Thomson Reuters on behalf of Thomson Reuters clients. The owner of this announcement warrants that: (i) the releases contained herein are protected by copyright and other applicable laws; and (ii) they are solely responsible for the content, accuracy and originality of the information contained therein. Source: STMicroelectronics via Thomson Reuters ONE HUG#1688060
STMicroelectronics : STMicroelectronics Signs Loan Agreement with the European Investment Bank
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