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STMicroelectronics Signs Loan Agreement With the European Investment Bank

STMicroelectronics Signs Loan Agreement With the European Investment Bank 
GENEVA -- (Marketwire) -- 03/26/13 --  STMicroelectronics (NYSE: STM) 


 
--  Euro 350 million multicurrency facility supports ST's R&D
    investments in Power, MEMS and Sensors, Microcontrollers, Advanced
    Analog and Healthcare high-growth applications
--  Euro 350 million floating-rate senior bonds repaid on March 17thwith
    available resources
--  ST capital structure further strengthened

  
STMicroelectronics (NYSE: STM), a global semiconductor leader serving
customers across the spectrum of electronics applications, has signed
a new Euro 350 million loan agreement with the European Investment
Bank (EIB). The facility, which has not yet been drawn by ST, is also
available in the US$ equivalent amount and has an option for
disbursement until September 2014 with final maturity eight years
after disbursement.  
This new facility, which further strengthens the long-established
relationship between ST and EIB, supports ST's activities in R&D and
innovation related to the design and realization of the next
generation of technologies and electronic devices for applications in
Power, MEMS, Microcontrollers, Advanced Analog and Healthcare. This
includes the full cycle from technology R&D and product development
to application solutions that include software development and
systems integration. These activities are mainly carried out in ST's
Italian sites of Agrate Brianza, Castelletto and Catania. 
Furthermore, on March 17th, 2013, ST repaid with available cash the
residual Euro 350 million floating-rate senior bonds outstanding with
a principal amount of Euro 500 million at issuance. ST's capital
structure, already supported by a net cash position of about US$ 1.19
billion at the end of Q4 2012, and existing committed credit lines
for about US$ 490 million, has been further strengthened by this new
credit facility from the EIB. 
About STMicroelectronics 
ST is a global leader in the semiconductor market serving customers
across the spectrum of sense and power and automotive products and
embedded processing solutions. From energy management and savings to
trust and data security, from healthcare and wellness to smart
consumer devices, in the home, car and office, at work and at play,
ST is found everywhere microelectronics make a positive and
innovative contribution to people's life. By getting more from
technology to get more from life, ST stands for life.augmented.
 In
2012, the Company's net revenues were $8.49 billion. Further
information on ST can be found at www.st.com  
ST EIB Loan Agreement: http://hugin.info/152740/R/1688060/553676.pdf  
For further information, please contact: 
INVESTOR RELATIONS:
Tait Sorensen 
Group VP, Investor Relations
STMicroelectronics
Tel: +1 602 485 2064
tait.sorensen@st.com 
MEDIA RELATIONS:
Nelly Dimey 
Director, Corporate Media and Public Relations
STMicroelectronics
Tel: +33 1 58 07 77 85
nelly.dimey@st.com 
 
 
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