STATS ChipPAC to Redeem the Outstanding $241.6 Million Principal Amount of Its 7.5% Senior Notes Due 2015

STATS ChipPAC to Redeem the Outstanding $241.6 Million Principal Amount of Its 
7.5% Senior Notes Due 2015 
SINGAPORE--20 MARCH 2013, UNITED STATES -- (Marketwire) -- 03/20/13
--  STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST:
STATSChP) (SGX: S24), a leading provider of advanced semiconductor
packaging and test services, today announced that it has given notice
to the holders of its outstanding $241.6 million of 7.5% Senior Notes
due 2015 (the "Existing Notes"), with ISIN/CUSIP: 85771TAH7,
Y8162BAE5, US85771TAH77 and USY8162BAE57, to exercise its option to
redeem all of the outstanding Existing Notes on 19 April 2013 (the
"Redemption Date") pursuant to the terms of the indenture, dated as
of 12 August 2010 (the "Indenture"), between the Company and The Bank
of New York Mellon, as trustee, governing the Existing Notes.  
Pursuant to the terms of the Indenture, the redemption price for the
Existing Notes will be equal to 105.848% of the principal amount
thereof, and accrued and unpaid interest, if any, to the Redemption
Date. The Existing Notes will be cancelled by the Company upon
Forward-looking Statements 
Certain statements in this release, including statements regarding
the Company's redemption of its outstanding Existing Notes, are
forward-looking statements. All forward-looking statements involve a
number of risks and uncertainties that could cause actual results to
differ materially from expectations. Factors that could cause actual
results to differ include factors discussed in its reports filed with
the Securities Exchange Securities Trading Limited ("SGX-ST"). You
should not unduly rely on such statements. We do not intend, and do
not assume any obligation, to update any forward-looking statements
to reflect subsequent events or circumstances.  
References to "$" are to the lawful currency of the United States of
About STATS ChipPAC Ltd.  
STATS ChipPAC Ltd. (SGX-ST Code: S24) is a leading service provider
of semiconductor packaging design, assembly, test and distribution
solutions in diverse end market applications including
communications, digital consumer and computing. With global
headquarters in Singapore, STATS ChipPAC has design, research and
development, manufacturing or customer support offices throughout
Asia, the United States and Europe. STATS ChipPAC is listed on the
SGX-ST. Further information is available at
Information contained in this website does not constitute a part of
this release.  
Investor Relations Contact:
Tham Kah Locke
Vice President of Corporate Finance 
Tel: (65) 6824 7788
Fax: (65) 6720 7826
Media Contact:
Lisa Lavin
Deputy Director of Marketing Communications
Tel: (208) 867-9859
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