STMicroelectronics Makes Leading-Edge MEMS Technology Available for Prototyping Through CMP

STMicroelectronics Makes Leading-Edge MEMS Technology Available for Prototyping 
Through CMP 
Initiative Sets to Advance New Application Developments in Motion
GENEVA and GRENOBLE, FRANCE -- (Marketwire) -- 03/19/13 -- 
STMicroelectronics (NYSE: STM) and CMP (Circuits Multi Projets(R))
today announced that ST's THELMA MEMS manufacturing process, the
process ST uses for its industry-leading accelerometers and
gyroscopes, which have shipped in billions of units[1], is now
available for prototyping to universities, research labs and design
companies through the silicon brokerage services provided by CMP. ST
is releasing this process technology to third parties as a
prototyping and foundry service to encourage new developments in
motion-sensing applications for consumer, automotive, industrial and
healthcare markets. 
ST's long-term success in MEMS (Micro-Electro-Mechanical Systems)
sensors has drawn upon Company-developed industry-leading
manufacturing processes. The 0.8-micron, surface micro-machining
THELMA (Thick Epitaxial Layer for Micro-gyroscopes and
Accelerometers) process combines variably thick and thin poly-silicon
layers for structures and interconnections. This enables the
integration of linear and angular mechanical elements in a single
chip, delivering significant cost and size benefits to customers. 
The CMP multi-project wafer service allows organizations to obtain
small quantities -- typically from a few dozens to a few thousand
units -- of advanced ICs manufactured using the same process
technologies as would be used on much higher-volume products. The
THELMA process design rules and design kits are now available for
universities and microelectronics companies and the first requests
are already being answered.  
The introduction of ST's MEMS manufacturing process in CMP's
catalogue builds on the successful collaboration that has allowed
universities and design firms to access ST's semiconductor
manufacturing processes from the 130nm CMOS, introduced in 2003, up
to the 28nm FD-SOI technology, released for prototyping in late 2012,
which enables the efficient design of next-generation mobile devices
that simultaneously require high performance and low power
"The small-scale availability of our industry-leading MEMS process
alongside CMOS technologies including the game-changing FD-SOI,
complemented with CMP's advanced service capabilities, offers
unprecedented access to state-of-the-art in chip manufacturing for
start-ups and R&D labs looking to design intelligent sensor systems,"
said Benedetto Vigna, Executive Vice President, General Manager,
Analog, MEMS & Sensors Group, STMicroelectronics. "With leading-edge
industrialized processes at their fingertips, innovators can now
concentrate on developing new products rather than investing time and
resources in developing technologies." 
"Anticipating huge development in MEMS, CMP was the first silicon
brokerage service in the world to offer MEMS technologies as early as
in 1995," said Bernard Courtois, Director of CMP. "Today, CMP is
expanding the very successful ST partnership to the THELMA process,
offering both the CMOS part and the MEMS part from a single
manufacturer. Going beyond inertial sensors, pressure sensors,
microphones, e-compasses etc., the ST-CMP partnership will allow CMP
customers to move towards complex, embedded systems, addressing more
and more societal needs, as components of the Internet of Things."  
Perspectives on Smart Systems for the Internet of Things will be
presented later today by ST's Benedetto Vigna in his opening keynote
address at the DATE (Design, Automation & test in Europe) event in
Grenoble, France. ( 
About STMicroelectronics
 ST is a global leader in the semiconductor
market serving customers across the spectrum of sense and power and
automotive products and embedded processing solutions. From energy
management and savings to trust and data security, from healthcare
and wellness to smart consumer devices, in the home, car and office,
at work and at play, ST is found everywhere microelectronics make a
positive and innovative contribution to people's life. By getting
more from technology to get more from life, ST stands for
In 2012, the Company's net revenues were $8.49 billion. Further
information on ST can be found at 
About CMP
 CMP is a broker in ICs and MEMS for prototyping and low
volume production. Circuits are fabricated for Universities, Research
Laboratories and Industrial Companies. Advanced industrial
technologies are available in CMOS, BiCMOS, SiGe BiCMOS, High
Voltage, FD-SOI down to 20nm, pHEMT GaAs, and MEMS etc. CMP
distributes and supports several CAD software tools for both
Industrial Companies and Universities. Since 1981, more than 1000
Institutions from 70 countries have been served, more than 6,000
projects have been prototyped through 700 runs, and 60 different
technologies have been interfaced. For more information, visit: 
[1] ST is the world's top MEMS manufacturer with cumulative shipments
of more than three billion MEMS devices, production capacity of 4
million devices a day, and, according to Yole Developpment, the first
company to reach $1 billion in MEMS sales 
ST MEMS Process at CMP: 
ST MEMS Process at CMP_IMAGE:  
For Press Information Contact: 
Michael Markowitz
+1 781 591 0354 
Bernard Courtois
+33 4 76 57 46 15 
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