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STMicroelectronics : STMicroelectronics Makes Leading-Edge MEMS Technology Available for Prototyping through CMP



  STMicroelectronics : STMicroelectronics Makes Leading-Edge MEMS Technology
                    Available for Prototyping through CMP

  Initiative sets to advance new application developments in motion sensing

                                       

Geneva, Switzerland, and Grenoble, France, March 19, 2013 - STMicroelectronics
(NYSE:STM) and CMP (Circuits Multi Projets®) today announced that ST's THELMA
MEMS manufacturing process, the process ST uses for its industry-leading
accelerometers and gyroscopes, which have shipped in billions of units^[1], is
now available for prototyping to universities, research labs and design
companies through the silicon brokerage services provided by CMP. ST is
releasing this process technology to third parties as a prototyping and
foundry service to encourage new developments in motion-sensing applications
for consumer, automotive, industrial and healthcare markets.

ST's long-term success in MEMS (Micro-Electro-Mechanical Systems) sensors has
drawn upon Company-developed industry-leading manufacturing processes. The
0.8-micron, surface micro-machining THELMA (Thick Epitaxial Layer for
Micro-gyroscopes and Accelerometers) process combines variably thick and thin
poly-silicon layers for structures and interconnections. This enables the
integration of linear and angular mechanical elements in a single chip,
delivering significant cost and size benefits to customers.

The CMP multi-project wafer service allows organizations to obtain small
quantities--typically from a few dozens to a few thousand units--of advanced
ICs manufactured using the same process technologies as would be used on much
higher-volume products. The THELMA process design rules and design kits are
now available for universities and microelectronics companies and the first
requests are already being answered.

The introduction of ST's MEMS manufacturing process in CMP's catalogue builds
on the successful collaboration that has allowed universities and design firms
to access ST's semiconductor manufacturing processes from the 130nm CMOS,
introduced in 2003, up to the 28nm FD-SOI technology, released for prototyping
in late 2012, which enables the efficient design of next-generation mobile
devices that simultaneously require high performance and low power
consumption.

"The small-scale availability of our industry-leading MEMS process alongside
CMOS  technologies including the game-changing FD-SOI, complemented with CMP's
advanced service capabilities, offers unprecedented access to state-of-the-art
in chip manufacturing for start-ups and R&D labs looking to design intelligent
sensor systems," said Benedetto Vigna, Executive Vice President, General
Manager, Analog, MEMS & Sensors Group, STMicroelectronics. "With leading-edge
industrialized processes at their fingertips, innovators can now concentrate
on developing new products rather than investing time and resources in
developing technologies."

"Anticipating huge development in MEMS, CMP was the first silicon brokerage
service in the world to offer MEMS technologies as early as in 1995," said
Bernard Courtois, Director of CMP. "Today, CMP is expanding the very
successful ST partnership to the THELMA process, offering both the CMOS part
and the MEMS part from a single manufacturer. Going beyond inertial sensors,
pressure sensors, microphones, e-compasses etc., the ST-CMP partnership will
allow CMP customers to move towards complex, embedded systems, addressing more
and more societal needs, as components of the Internet of Things."

Perspectives on Smart Systems for the Internet of Things will be presented
later today by ST's Benedetto Vigna in his opening keynote address at the DATE
(Design, Automation & test in Europe) event in Grenoble, France.
(http://www.date-conference.com/).

About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the
spectrum of sense and power and automotive products and embedded processing
solutions. From energy management and savings to trust and data security, from
healthcare and wellness to smart consumer devices, in the home, car and
office, at work and at play, ST is found everywhere microelectronics make a
positive and innovative contribution to people's life. By getting more from
technology to get more from life, ST stands for life.augmented.

In 2012, the Company's net revenues were $8.49 billion. Further information on
ST can be found at www.st.com.

About CMP
CMP is a broker in ICs and MEMS for prototyping and low volume production.
Circuits are fabricated for Universities, Research Laboratories and Industrial
Companies. Advanced industrial technologies are available in CMOS, BiCMOS,
SiGe BiCMOS, High Voltage, FD-SOI down to 20nm, pHEMT GaAs, and MEMS etc. CMP
distributes and supports several CAD software tools for both Industrial
Companies and Universities. Since 1981, more than 1000 Institutions from 70
countries have been served, more than 6,000 projects have been prototyped
through 700 runs, and 60 different technologies have been interfaced. For more
information, visit: http://cmp.imag.fr

For Press Information Contact:

STMicroelectronics
Michael Markowitz
+1 781 591 0354
michael.markowitz@st.com

CMP
Bernard Courtois
+33 4 76 57 46 15
Bernard.Courtois@imag.fr

-------------------------

[1] ST is the world's top MEMS manufacturer with cumulative shipments of more
than three billion MEMS devices, production capacity of 4 million devices a
day, and, according to Yole Developpment, the first company to reach $1
billion in MEMS sales

ST MEMS Process at CMP_IMAGE
ST MEMS Process at CMP

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This announcement is distributed by Thomson Reuters on behalf of Thomson
Reuters clients.

The owner of this announcement warrants that:
(i) the releases contained herein are protected by copyright and other
applicable laws; and
(ii) they are solely responsible for the content, accuracy and originality of
the
information contained therein.

Source: STMicroelectronics via Thomson Reuters ONE
HUG#1686205
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