Kulicke & Soffa Launches New LED Package Singulation Blades - OptoTMceramic
SEMICON China 2013
SINGAPORE -- March 18, 2013
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“K&S”) today announced the
launch of its new Opto^TM[ceramic] and Opto^TM[PCB] Package Singulation
Blades for the LED market.
Opto^TM Hub and Hubless Blades significantly improve LED package singulation
quality, precision and productivity, by providing improved stability and
longer blade life. Highlighted features of the new Opto^TM blades include:
attractive cost of ownership through consistently longer blade life, 100%
pre-dressed to shorten on-site dressing steps, and an optional kerf control
feature to meet special application requirements. Significant UPH improvement
has been observed in some applications by enabling higher feed speeds.
The new Opto^TM[ceramic] blade utilizes unique electroplating technology to
achieve up to 3 times the blade life of traditional resin/metal bonded blades,
with minimal kerf change and blade wear. The new design minimizes machine
downtime for blade changes, achieves the highest cut quality, and allows
higher feed speeds, increasing productivity.
The new Opto^TM[PCB] blade for PCB & composite material substrates has an
optimized design which provides uniform vertical wear, maintaining cutting
power and consistent sawn package dimensions, thus eliminating in-process
dressing steps. The optional ‘slits’ feature improves blade cooling, achieving
high singulation quality without typical whisker issues.
Nelson Wong, Vice President – Wire Bonding Solutions Business Unit, said: “The
Opto^TM blades provide a significant CoO improvement and a ‘plug and play’
solution for most dicer spindle configurations. Moreover, the hub-type design
provides flexibility to various dicer configurations for package singulation
and enhances machine utilization and factory productivity.”
The Opto^TM[ceramic] & Opto^TM[PCB] will debut at the Semicon China show at
the Shanghai New International Expo Centre from March 19-21, 2013.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and
manufacture of semiconductor and LED assembly equipment. As a pioneer in this
industry, K&S has provided customers with market leading packaging solutions
for decades. In recent years, K&S has expanded its product offerings through
strategic acquisitions, adding wedge bonding and a broader range of expendable
tools to its core ball bonding products. Combined with its extensive expertise
in process technology, K&S is well positioned to help customers meet the
challenges of assembling the next-generation semiconductor and LED devices.
Kulicke & Soffa Industries, Inc.
Investor Relations & Strategic Planning
Global IR Partners
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