NXP Launches Industry's First Dual-Modem AISG Transceiver for Wireless Base Stations
NXP Launches Industry's First Dual-Modem AISG Transceiver for Wireless Base Stations
Fully Integrated, Programmable Solution Also Available With Embedded ARM(R) Cortex(TM)-M3 Processor
EINDHOVEN, THE NETHERLANDS -- (Marketwire) -- 03/18/13 -- NXP Semiconductors N.V. (NASDAQ: NXPI) today introduced a groundbreaking family of programmable AISG transceivers for wireless base stations and antenna line devices (ALDs) such as tower-mounted amplifiers (TMAs) and remote electric tilt (RET) antennas. The new family includes the industry's first fully integrated dual-modem AISG transceivers, as well as the first AISG system solution to integrate an ARM(R) Cortex(TM)-M3 processor alongside two AISG modems. DSP-based and programmable, NXP's AISG transceivers offer significant flexibility, making it easy to change settings during development, manufacturing, or even site installation. While many manufacturers today use a separate microcontroller and a high number of discrete components to deliver AISG on-off keying (OOK) modem functionality, the exceptionally high level of integration delivered by NXP's transceivers helps to reduce the total component count, board space and costs, while introducing advanced functionality.
Remote electric tilt enables dynamic adjustment of base station antenna beams for optimal network coverage, and is becoming a standard feature for wireless base station antennas. By embedding AISG transceiver functionality inside the antenna itself to control the RET, infrastructure providers can eliminate additional Smart-Bias-T and RS485 cabling to the antenna, increasing reliability while reducing tower costs. NXP's dual-modem AISG devices are particularly suitable for ALDs with multiple feeder cable connections, like TMAs and multiband antennas. Further, the AISG transceivers can be used as part of a larger framework, outlined separately by NXP in a white paper released today, to enable remote "site scans" and monitoring of mobile tower cabling connectivity failures, which typically requires costly, inefficient tower climbing and visual inspections. A video overview of NXP's AISG transceivers is available here: http://youtu.be/uxU2FJSIZuc
"While the Antenna Interface Standards Group protocol has been a major step in the right direction, the fact remains that there is still no way to effectively gather information on mobile tower connectivity remotely. With the growth of 3G and LTE, the complexity of wireless base stations and the number of antennas and other devices installed from various manufacturers will increase dramatically -- compounding maintenance costs and headaches for both network operators and equipment manufacturers," said Rick Dumont, global marketing director for AISG products, NXP Semiconductors. "Our new AISG transceivers provide a compact and cost-effective solution for multi-channel AISG communication between tower-mounted ALDs and the base station to optimize base station site performance. At the same time, we're opening the door to better interoperability across components, which could ultimately allow remote monitoring, diagnostics and debugging of a wider range of devices in the tower."
AISG transceivers with multi-carrier feature The single-modem ASC3011 and dual-modem ASC3012 are power-efficient, highly integrated AISG modems in a small HVQFN64 package. The modems can interface via a two- or three-wire UART or with an RS485 transceiver, and modem parameters can be programmed using an I2C interface. Up to 4 NXP AISG transceivers (providing up to 8 AISG OOK modems) can be connected to a single I2C-bus, and each modem can be programmed with its own settings as required by the base station site.
In addition to the default AISG carrier frequency of 2.176 MHz, all NXP AISG transceivers also support 4.352-MHz and 6.528-MHz carrier frequencies. This offers the possibility of multiplexing 3 AISG channels on the same RF feeder cable. Receiver bandpass filters are integrated to effectively block any out-of-band interference signals. Users can program the receiver sensitivity to "High" and "Ultra High" levels, in addition to standard AISG sensitivity. The transmitter can deliver up to 10 dBm power to the RF feeder cable, and can have an integrated 50-ohm receiver and transmitter termination. The transceivers conform to AISG1: Issue 1.1 and AISG v2.0.
AISG transceivers with embedded ARM Cortex-M3 microcontroller The single-modem ASC3101 and dual-modem ASC3112 are optimized AISG controllers, including a 94-MHz ARM Cortex-M3 processor with integrated AISG modem(s) and all peripheral interfaces required to control antenna line devices. These peripherals include 6 PWM outputs to drive RET antenna motors, and a number of general purpose ADCs/DACs for measurement and control functions.
The integrated AISG transceivers with the embedded ARM processor are shipped with a full software development kit (SDK), including the reference AISG stack for basic control and power management, which is provided to all NXP AISG customers to promote device interoperability. Each controller offers up to 256 kB of embedded flash and 16 kB of SRAM to run the application software. In addition, a real-time clock with 32 kHz crystal and 44 configurable GPIOs are available. The DSP-based modem also facilitates field upgrades for higher transfer speeds that comply with future protocols. The programmable modems enable optimization of receiver sensitivity, based on signal strength.
Availability The ASC3101, ASC3112, ASC3011 and ASC3012 are currently sampling with lead customers, with volume manufacturing starting at the end of March 2013.
-- VIDEO: Introducing NXP's dual-modem AISG transceivers for wireless base stations: http://youtu.be/uxU2FJSIZuc -- NXP AISG transceivers and controllers: http://www.nxp.com/products/rf/aisg_transceivers_and_controllers/ -- WHITE PAPER: Proposal for Basestation Site Scanning with AISG Modems: http://www.nxp.com/documents/white_paper/NXP_Basestation_Site_Scanning_proposal_ with_AISG_modems_web.pdf
About NXP Semiconductors NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted unaudited revenue of $4.36 billion in 2012. Additional information can be found by visiting www.nxp.com.
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov. Embedded Video Available: http://www2.marketwire.com/mw/frame_mw?attachid=2258655
Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2258651
Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2258654
For further press information, please contact:
Global: Eureka Endo +44 795 828 7483 firstname.lastname@example.org
GC: Jannet Chen +86 21 22055883 email@example.com
NA: Lisa Silver +1 617 399 4913 firstname.lastname@example.org
APAC: Preeti Gupta +65 6603 9022 email@example.com