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Kulicke & Soffa Extends Power Series to Wedge Bond with PowerFusionPS

  Kulicke & Soffa Extends Power Series to Wedge Bond with PowerFusionPS

SEMICON China 2013

Business Wire

SINGAPORE -- March 18, 2013

Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“K&S” or the “Company”) today
announced another extension of its highly successful K&S Power Series^TM
equipment. The Company’s new high performance Orthodyne wedge bonder,
PowerFusion^PS, is driven by a new powerful direct-drive motion system and
expanded pattern recognition capabilities which deliver industry leading
productivity and performance.

The PowerFusion^PS fits well into the Power Series of products, known for
setting new standards for productivity, performance, advanced package
capability, ease of use, configuration flexibility and reliability.
PowerFusion^PS boasts increased UPH that is enabled by the direct-drive servo
system and faster pattern recognition find times. It also shows higher MTBA
due to the improved pattern recognition. The advanced package capabilities of
PowerFusion^PS improves the processing of high-density power packages, due to
an expanded bondable area, wider leadframe capability and superior indexing
accuracy and teach mode.

PowerFusion^PS is available in two different models with single or multiple
head configurations. The TL Model is the perfect choice for bonding single-row
to four-row matrix TO- power discrete packages. The enhanced HL model is
intended for advanced power package designs. When bonding high density power
devices, like SO-8 & PDFN, or stretching the wire limits on a matrix D-Pak,
the superior indexing accuracy and clamping capabilities of the HL Model
deliver consistent performance.  Both Models provide industry leading
productivity that lowers cost of ownership by improved uptimes and higher bond
yields.

Matt Vorona, Kulicke & Soffa’s Vice President – Wedge Bond Business Unit,
remarked, "Our state of the art PowerFusion^PS series by K&S launches a
product firmly in the tradition of Orthodyne wedge bonders, well known in the
power semiconductor industry for leading edge innovation, productivity and
performance."

Customers can view the highly anticipated wedge bonder during the SEMICON
China show from March 19-21, 2013 in the Kulicke & Soffa Booth #3401.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and
manufacture of semiconductor and LED assembly equipment. As a pioneer in this
industry, K&S has provided customers with market leading packaging solutions
for decades. In recent years, K&S has expanded its product offerings through
strategic acquisitions, adding wedge bonding and a broader range of expendable
tools to its core ball bonding products. Combined with its extensive expertise
in process technology, K&S is well positioned to help customers meet the
challenges of assembling the next-generation semiconductor and LED devices.
(www.kns.com)

Contact:

Kulicke & Soffa Industries, Inc.
Sheila Frese
Public Relations
P: +1-949-660-0440
F: +1-949-660-0444
sfrese@kns.com
or
Kulicke & Soffa Industries, Inc.
Joseph Elgindy
Investor Relations & Strategic Planning
P: +1-215-784-7518
F: +1-215-784-6180
jelgindy@kns.com
or
Global IR Partners
David Pasquale
P: +1-914-337-8801
klic@globalirpartners.com