Kulicke & Soffa Extends Power Series to Wedge Bond with PowerFusionPS SEMICON China 2013 Business Wire SINGAPORE -- March 18, 2013 Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“K&S” or the “Company”) today announced another extension of its highly successful K&S Power Series^TM equipment. The Company’s new high performance Orthodyne wedge bonder, PowerFusion^PS, is driven by a new powerful direct-drive motion system and expanded pattern recognition capabilities which deliver industry leading productivity and performance. The PowerFusion^PS fits well into the Power Series of products, known for setting new standards for productivity, performance, advanced package capability, ease of use, configuration flexibility and reliability. PowerFusion^PS boasts increased UPH that is enabled by the direct-drive servo system and faster pattern recognition find times. It also shows higher MTBA due to the improved pattern recognition. The advanced package capabilities of PowerFusion^PS improves the processing of high-density power packages, due to an expanded bondable area, wider leadframe capability and superior indexing accuracy and teach mode. PowerFusion^PS is available in two different models with single or multiple head configurations. The TL Model is the perfect choice for bonding single-row to four-row matrix TO- power discrete packages. The enhanced HL model is intended for advanced power package designs. When bonding high density power devices, like SO-8 & PDFN, or stretching the wire limits on a matrix D-Pak, the superior indexing accuracy and clamping capabilities of the HL Model deliver consistent performance. Both Models provide industry leading productivity that lowers cost of ownership by improved uptimes and higher bond yields. Matt Vorona, Kulicke & Soffa’s Vice President – Wedge Bond Business Unit, remarked, "Our state of the art PowerFusion^PS series by K&S launches a product firmly in the tradition of Orthodyne wedge bonders, well known in the power semiconductor industry for leading edge innovation, productivity and performance." Customers can view the highly anticipated wedge bonder during the SEMICON China show from March 19-21, 2013 in the Kulicke & Soffa Booth #3401. About Kulicke & Soffa Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor and LED assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. (www.kns.com) Contact: Kulicke & Soffa Industries, Inc. Sheila Frese Public Relations P: +1-949-660-0440 F: +1-949-660-0444 email@example.com or Kulicke & Soffa Industries, Inc. Joseph Elgindy Investor Relations & Strategic Planning P: +1-215-784-7518 F: +1-215-784-6180 firstname.lastname@example.org or Global IR Partners David Pasquale P: +1-914-337-8801 email@example.com
Kulicke & Soffa Extends Power Series to Wedge Bond with PowerFusionPS
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