Breaking News

China October Manufacturing PMI 50.8; Est. 51.2
Tweet TWEET

3S PHOTONICS and Finisar Partner on New Packaging Platform for 980nm Cooled Pump Laser Modules

3S PHOTONICS and Finisar Partner on New Packaging Platform for 980nm Cooled 
Pump Laser Modules 
NOZAY, FRANCE and SUNNYVALE, CA -- (Marketwire) -- 03/12/13 --  3S
PHOTONICS, a world-leading manufacturer in optical and optoelectronic
components for telecommunication networks, and Finisar Corporation
(NASDAQ: FNSR), the world's largest supplier of optical communication
components and subsystems, today announced their formal agreement to
launch a partnership for the development of a new packaging platform
for 980nm cooled laser pump modules. 
Under this agreement, 3S PHOTONICS will be the exclusive supplier of
the 980nm laser chips used for this platform, and Finisar will
implement a manufacturing line based on this platform in its newly
expanded facilities in Wuxi, China. Finisar will use these 980nm pump
modules in their industry-leading EDFA and Line Card products for the
telecom market. 3S PHOTONICS will use the packaging platform to serve
its own customers.  
Alexandre Krivine, CEO of 3SPGroup, commented: "We are very pleased
to launch this agreement which will allow 3S PHOTONICS to gain access
to an alternative competitive packaging platform that will improve
the fixed cost absorption of our wafer fab. We are proud to be
selected as the sole supplier by Finisar for these high power
applications, which is recognition of the leading performance and
reliability of our 980nm chips." 
"This partnership provides Finisar with strategic access to high
performance and highly reliable 980nm chips while leveraging our own
expertise in high-volume, cost-effective manufacturing," said Eitan
Gertel, CEO of Finisar. "This combination allows us to quickly
provide the products that our customers are demanding to support
growing telecom networks."  
The 980nm lasers supplied by 3SPGroup are already fully qualified
with outstanding field reliability. The availability of the modules
resulting from this new packaging platform is expected by mid-2013. 
About 3SPGroup
 3SPGroup is a leading provider of innovative optical
products and solutions for Lasers, Sensing & Telecom markets. The
Group designs, manufactures, and markets high reliability active &
passive optical components and modules for the telecom, sensing &
laser markets. It develops ultra-reliable fiber-optic systems
including high-power fused components, optical sensors and fiber
laser components. Through its Avensys Solutions division, it also
provides instrumentation and integrated solutions for process and
environmental monitoring systems. Eurazeo, one of the leading listed
investment companies in Europe, is the majority shareholder of
3SPGroup.  
For additional information, visit www.3spgroup.com 
About Finisar
 Finisar Corporation (NASDAQ: FNSR) is a global
technology leader of fiber optic subsystems and components that
enable high-speed voice, video and data communications for
networking, storage, wireless, and cable TV applications. For 25
years, Finisar has provided critical optics technologies to system
manufacturers to meet the increasing demands for network bandwidth.
Finisar is headquartered in Sunnyvale, California, USA with R&D,
manufacturing sites, and sales offices worldwide. For additional
information, visit www.finisar.com. Stay up to date with Finisar by
reading the Lightspeed blog and connect with us on Twitter, Facebook,
and the Finisar YouTube Channel.  
Finisar is a registered trademark of Finisar Corporation.  
Press Contacts
Finisar Corporation
Victoria McDonald
+1 (408) 542-4261
press@finisar.com
www.finisar.com 
3SPGroup
Louise Clement
 +1 (514) -428-6766 # 6803 
lclement@3spgroup.com
www.3spgroup.com 
 
 
Press spacebar to pause and continue. Press esc to stop.