Freescale Exceeds 175 Million Plastic-Packaged RF Power Transistors Shipped
Achievement underscores continued technology leadership for industry’s No. 1
provider of advanced RF power products
AUSTIN, Texas -- March 11, 2013
Freescale Semiconductor (NYSE: FSL), the worldwide leader in high-power radio
frequency (RF) power transistors, recently reached a milestone unparalleled in
the industry – shipment of more than 175 million high-power, high-frequency RF
power transistors in plastic packages.
Freescale's RF power over-molded plastic packaging provides cost-effective and
reliable alternatives to conventional, more expensive metal-ceramic packaging.
Freescale’s plastic packaging withstands and dissipates the high heat levels
generated by RF power transistors while maintaining optimal performance
levels. This packaging technology is often far less expensive on a per-unit
basis than comparable devices in air-cavity packages, and over-molded plastic
devices simplify customer's manufacturing processes by enabling a more
efficient automated assembly.
“Freescale not only pioneered the development of high-power RF packaging to
meet the demanding requirements of power amplifier manufacturers, but we
continue to set the pace in plastic package performance, temperature ratings,
reliability and volume production,” said Ritu Favre, senior vice president and
general manager for Freescale’s RF business. “Shipping more than 175 million
RF power devices in plastic packages underscores the broad market acceptance
of Freescale's innovative plastic packaging technology.”
Freescale's heritage of plastic packaging leadership spans more than 30 years.
In the mid-1980s the company pioneered low-frequency, high-power plastic
packaging for the automotive and industrial industries. In 1997, Freescale
delivered the industry's first high-power, high-frequency RF devices in
plastic packages optimized for wireless infrastructure applications. Nine
years later, Freescale introduced the first 2 GHz RF power plastic devices
with a maximum junction temperature rating of 225 degrees Celsius, which for
the first time matched the frequency, thermal performance, maximum junction
temperature, standards compliance and reliability of traditional RF
transistors in metal-ceramic packages. And in 2009, Freescale further extended
its technology leadership in plastic packaging with the introduction of OMNI
over-molded plastic packaging engineered for applications in which extreme
power, performance and temperature requirements are common.
Freescale offers the industry's broadest portfolio of RF power devices in
plastic packages, with 12 outlines from which to choose. The current portfolio
covers two- and three-stage driver ICs, as well as two-stage and discrete
finals. The output power of the devices ranges from 20 dBm to as high as 300
watts and frequencies from 10 MHz to 2.7 GHz. In addition, Freescale continues
to make the necessary investments in research and development to meet the
rapidly evolving and challenging requirements of RF industries.
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Freescale Semiconductor(NYSE: FSL) is a global leader in embedded processing
solutions, providing industry leading products that are advancing the
automotive, consumer, industrial and networking markets. From microprocessors
and microcontrollers to sensors, analog integrated circuits and connectivity –
our technologies are the foundation for the innovations that make our world
greener, safer, healthier and more connected. Some of our key applications and
end-markets include automotive safety, hybrid and all-electric vehicles, next
generation wireless infrastructure, smart energy management, portable medical
devices, consumer appliances and smart mobile devices. The company is based
inAustin, Texas, and has design, research and development, manufacturing and
sales operations around the world.www.freescale.com
Freescale, and the Freescale logo are trademarks of Freescale Semiconductor,
Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the
property of their respective owners. © 2013 Freescale Semiconductor, Inc.
Jack Taylor, 512-996-5161
Gloria Shiu, (85-22) 666-8237
Europe, Middle East and Africa:
Laurent Massicot, (33-16) 935-7712
Anjali Srivastava, (91-120) 395-0000
Kiyomi Masuda, (81-3) 5437-9128
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