AGC and nMode Solutions Launch Subsidiary Triton Micro Technologies to
Develop Novel Via-Fill Technology for Advanced Semiconductor Packaging
International Alliance Forms New Company to Commercialize Next-Generation IC
Packaging Products Using Ultra-Thin Glass
TUCSON, Ariz. -- March 11, 2013
Leveraging synergies in their respective technologies, Tokyo-based Asahi Glass
Co., Ltd. (AGC) and nMode Solutions Inc. of Tucson, Arizona, have invested
$2.1 million to co-found a subsidiary business, Triton Micro Technologies
(www.tritonmicrotech.com), to develop innovative via-fill technology for
interposers, enabling next-generation semiconductor packaging solutions using
ultra-thin glass. The new company, headquartered in Tucson with a
manufacturing facility planned in California, will combine nMode’s interposer
technology for electrically connecting semiconductor devices with AGC’s
materials technology and micro-hole drilling techniques to produce
2.5-dimensional (2.5D) and three-dimensional (3D) through-glass-via (TGV)
interposers needed for advanced semiconductor devices.
To achieve the next generation in high-density semiconductor packaging,
interposer technologies are needed to form the high number of electrical
connections between a silicon chip and a printed circuit board. Interposers
allow high packaging integration in the smallest available form factors.
Triton Micro Technologies will manufacture ultra-thin glass interposers using
a high-efficiency continuous process that lowers costs and helps to
commercialize the widespread use of interposers. The company will draw upon
nMode’s intellectual property and AGC’s proven carrier-glass technology and
via-hole drilling methodologies to fabricate its interposers. Triton then will
apply its proprietary technology to fill the high-aspect-ratio via holes with
a copper paste that has the same coefficient of thermal expansion as glass.
This reduces the potentially damaging effects of thermal stress during
manufacturing and long-term use. Triton’s process creates high-quality
electrodes within the interposer to provide the electrical interface capable
of accommodating advanced, high-density ICs.
Triton’s interposers are compatible with wafers having diameters from 100 mm
to 300 mm and thicknesses of 0.7 mm and below. The company also can design and
manufacture customized solutions for unique applications.
“The global semiconductor industry recognizes that silicon is approaching its
performance limits as an interposer material, but the need remains to create
smaller, more efficient packages for today’s and tomorrow’s high-performance
ICs,” said Tim Mobley, CEO at Triton. “Our technology allows us to achieve
known-good-die testing at the highest levels of packaging integration, faster
cycle times and the lowest cost per unit in the market.”
About the AGC Group
The AGC Group, with Tokyo-based Asahi Glass Co., Ltd. at its core, is a
world-leading supplier of flat, automotive and display glass, chemicals and
other high-tech materials and components. Drawing on more than a century of
technical innovation, the AGC Group has developed world-class expertise in
fields including glass, fluorine chemistry and ceramics technologies. The
group employs some 50,000 people worldwide and generates annual sales of more
than 1 trillion yen through business in about 30 countries. For more
information, please visit www.agc.com/english/.
About nMode Solutions
nMode Solutions uses its high-frequency design and fabrication expertise to
provide advanced, proprietary wafer-level packaging solutions for 2D and 3D IC
designs. The company also provides unique high-frequency electronic component
designs for high performance above 10 GHz. nMode uses a proprietary,
revolutionary glass to provide the market with unique radio-frequency (RF) and
microwave components. For more information, visit www.nmodesolutions.com.
Tim Mobley, 520-209-1556
Asahi Glass Co., Ltd.
General Manager, Corporate Communications & Investor Relations
Satoshi Yoshida, +81-3-3218-5603
Bruce Hokanson, 360-258-1260
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