ESI Revolutionizes Flexible Circuit and Interconnect Processing with its New Model 5335

  ESI Revolutionizes Flexible Circuit and Interconnect Processing with its New
  Model 5335

Business Wire

PORTLAND, Ore. -- March 5, 2013

Electro Scientific Industries, Inc. (NASDAQ: ESIO), a leading supplier of
innovative laser-based manufacturing solutions for the microtechnology
industry, today announced the release of its Model 5335 UV Laser Drilling
System. As successor to the market-leading 5330 product family, the 5335
benefits from over 15 years of market experience and R&D efforts to deliver
the industry’s lowest cost of ownership in flexible circuit and general
micromachining applications through improved throughput and quality.

The 5335 brings state of the art performance to the flexible circuit and
general micromachining industry by use of its proprietary Third Dynamics™
technology. With this technology, the 5335 provides enhanced optical beam
manipulation beyond what is achievable with simple galvanometer control. Third
Dynamics™ enables industry-leading drill, routing, and skiving performance
through a combination of ESI's patented compound beam positioning and
solid-state optical technologies.

“We are very excited about the 5335’s upgraded productivity and convenient
operation,” said Jae-Hong Min, president of long-time ESI customer and partner
Korea Via Tech. After experiencing the benefits of the Model 5335 over a trial
period, this supplier to PCB manufacturing heavyweights such as Samsung and LG
Innotek placed a multi-system order. Min explained, “We expect that the 5335’s
high productivity and quality will positively impact confidence amongst

The 5335’s patented solid-state beam steering technologies, advanced motion
control algorithms and sophisticated power control processes enable gains in
throughput and quality. Martin Orrick, Director of Product Development for
ESI’s Micromachining, Test and Inspection division, stated, “The 5335
represents the seventh generation in ESI’s single-head UV laser drilling
tools. ESI has engineered the system around building blocks field-tested in
hundreds of systems worldwide while further enhancing it with capabilities
never before seen in the laser material processing industry. As a market
leader in UV laser tools with over 1,000 such systems sold, we are convinced
that this is the most flexible and productive UV laser tool available today.”

The 5335 is currently available for sale and is priced to deliver the
industry’s lowest cost of ownership.

About ESI, Inc.

ESI is a leading supplier of innovative, laser-based manufacturing solutions
for the microtechnology industry. Our systems enable precise structuring and
testing of micron to submicron features in electronic devices, semiconductors,
LEDs and other high-value components. We partner with our customers to make
breakthrough technologies possible in the microelectronics, semiconductor and
other emerging industries. Founded in 1944, ESI is headquartered in Portland,
Ore., with global operations from the Pacific Northwest to the Pacific Rim.
More information is available at

About Korea Via Tech

Korea Via Tech (KVT) is a leading subcontractor company specializing in the
PCB laser drilling market. First established in May 2003, KVT currently
employs over 60 UV and 30 CO2 laser drilling systems. With a customer base
including Samsung and LG Innotek, KVT is known as one of Korea’s largest UV
laser drilling subcontractors. KVT is headquartered in DaeJeon and
manufactures in three more branches in Ansan, Osan and Gumi. KVT’s satisfies
its customers through reliable productivity and manufacturing quality that is
enabled by its employees’ highly specialized training and experience and its
state-of-the-art equipment. More information is available at


Brian Smith, 503-672-5760
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