Texas Instruments and 4DSP collaborate on FPGA mezzanine card, enabling
mission critical developers to meet vital COTS-based system requirements
DALLAS, March 5, 2013
DALLAS, March 5, 2013 /PRNewswire/ --Texas Instruments Incorporated (TI)
(NASDAQ: TXN) and 4DSP, an innovative company specializing in low power, low
weight and compact FPGA-based signal and image processing systems, today
announced their collaboration on a new mezzanine card, the FMC667, for mission
critical applications. 4DSP's FMC667 mezzanine card, based on the emerging FMC
form factor, includes TI's KeyStone-based TMS320C6678 multicore digital signal
processor (DSP), DRAM memory and peripherals. With TI's high-performance C6678
multicore DSP, the FMC667 is able to more effectively and rapidly meet the
essential requirements of Commercial Off-The-Shelf (COTS)-based systems, as
well as increase processing power, accuracy and finer resolution in mission
critical and industrial applications.
"TI's multicore software development kit made it easy for us to develop
support libraries for our FMC667 card," said Arnaud Maye, Embedded Software
Manager at 4DSP. "With eight 1.25 GHz cores in parallel and the built-in
capability to be a PCIe root complex, TI's C6678 DSP affirms itself as a
control and high-end processing node for the most demanding applications."
4DSP's FMC667 card is primarily intended to be used in applications where an
FPGA and DSP act as a co-processor of one another, such as video, telecom
infrastructure, imaging, medical and wireless infrastructure markets.
Mechanically and electrically compliant to the FMC standard (ANSI/VITA 57.1),
the FMC667 module has a high-pin count connector and can be used in a
conduction-cooled environment.Additionally, the card is also equipped with
power supply and temperature monitoring, offering several power-down modes to
switch off unused functions and peripheral interfaces.
Functionality, reliability and precision are vital factors mission critical
developers must take into consideration when designing quality system
applications. TI's C6678 multicore DSPs deliver the industry's first 10 GHz
DSP with fixed- and floating-point performance on a single device for
increased precision, a key requirement for mission critical systems.
Additionally, the C6678 multicore DSPs increase system capabilities by
consolidating the functionality of multiple DSPs onto a single device, saving
board space and cost and alleviating the challenge of size, weight and power
(SwaP), as well as reducing overall clock rates and power consumptions.
The FMC667 mezzanine card will be available on March 15. For more information,
please visit www.4dsp.com.
Do MORE with MULTICORE:
oLearn more about TI multicore
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About TI's KeyStone multicore architecture
TI's KeyStone multicore architecture is the platform for true multicore
innovation, offering developers a robust portfolio of high performance,
low-power multicore devices.Unleashing breakthrough performance, the KeyStone
architecture is the foundation upon which TI's new TMS320C66x DSP generation
was developed. KeyStone differs from any other multicore architecture as it
has the capacity to provide full processing capability to every core in a
multicore device. KeyStone-based devices are optimized for high performance
markets including wireless base stations, mission critical, test and
automation, medical imaging and high performance computing. Learn more at
About 4DSP LLC
4DSP is an innovative company specializing in low power, low weight and
compact FPGA based signal and image processing systems. Headquartered in
Austin, Texas, USA, with offices in the Netherlands, 4DSP is a developer of
reconfigurable computers of advanced architecture which offer customers
maximum flexibility and scalability. 4DSP's hardware platforms deliver
unmatched performance for advanced digital signal processing (DSP)
applications in embedded computing applications. More information about 4DSP
can be found at http://www.4dsp.com.
About Texas Instruments
Texas Instruments semiconductor innovations help 90,000 customers unlock the
possibilities of the world as it could be – smarter, safer, greener, healthier
and more fun. Our commitment to building a better future is ingrained in
everything we do – from the responsible manufacturing of our semiconductors,
to caring for our employees, to giving back inside our communities. This is
just the beginning of our story. Learn more at www.ti.com.
All trademarks are the property of their respective owners.
SOURCE Texas Instruments Incorporated
Contact: Sarika Patel, GolinHarris (TI), +1-972-341-2504,
email@example.com; or Debbie Shemony, Texas Instruments, +1-301-407-9338,
firstname.lastname@example.org; or Michael Brown, 4DSP, +1-775-233-5784,
email@example.com (Please do not publish these numbers or e-mail
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