STATS ChipPAC Announces Pricing of $255.0 Million 4.5% Senior Notes Due 2018

STATS ChipPAC Announces Pricing of $255.0 Million 4.5% Senior Notes Due 2018 
SINGAPORE--5 March 2013, UNITED STATES -- (Marketwire) -- 03/04/13 --
 STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST:
STATSChP) (SGX: S24), a leading provider of advanced semiconductor
packaging and test services, today announced the pricing of its
private placement (the "Concurrent Offering") of $255.0 million of
4.5% Senior Notes due 2018 (the "New Notes"). The New Notes to be
issued in the Concurrent Offering will constitute a single series
with, and will be issued under the same indenture and have the same
terms and conditions as the New Notes to be issued in exchange for
its 7.5% Senior Notes due 2015 (the "Existing Notes"), with
ISIN/CUSIP: 85771TAH7, Y8162BAE5, US85771TAH77 and USY8162BAE57, in
its private exchange offer ("Exchange Offer") that was announced on
14 February 2013. The New Notes to be issued in the Concurrent
Offering will be issued at par. The Concurrent Offering is expected
to close concurrently with the settlement of its Exchange Offer on
Wednesday, 20 March 2013 and is subject to the completion of the
Exchange Offer and the satisfaction of other customary closing
conditions. 
The New Notes will constitute senior, unsecured obligations of STATS
ChipPAC and will be guaranteed on a senior, unsecured basis by all of
STATS ChipPAC's wholly-owned subsidiaries, other than wholly-owned
subsidiaries located in the People's Republic of China and, if
required regulatory approvals are not obtained, South Korea. The New
Notes will mature on 20 March 2018. Interest at the rate of 4.5% per
annum on the New Notes will be payable semi-annually on 20 March and
20 September of each year, beginning 20 September 2013. The New Notes
will be redeemable at STATS ChipPAC's option on or after 20 March
2016 at certain prices and upon a change of control at 101% of their
principal amount, in each case plus accrued and unpaid interest.
Prior to 20 March 2016, the New Notes are redeemable at STATS
ChipPAC's option at a make-whole premium plus accrued and unpaid
interest. 
The Company intends to use the net proceeds from the Concurrent
Offering, together with cash on hand, to fund payment of fractional
entitlements under the terms of the Exchange Offer and refinance any
rem
aining Existing Notes that are not tendered in the Exchange Offer. 
Subject to the completion of the Concurrent Offering, the Company
intends to exercise its "make-whole" call right, pursuant to the
terms of the Existing Notes, to redeem any Existing Notes not
tendered in the Exchange Offer promptly after the settlement of the
Exchange Offer. 
STATS ChipPAC has received approval in-principle from the Singapore
Exchange Securities Trading Limited ("SGX-ST") for the listing of the
New Notes on the SGX-ST. Admission to the Official List of the SGX-ST
and quotation of the New Notes on the SGX-ST is not to be taken as an
indication of the merits of STATS ChipPAC or the New Notes. 
The New Notes were offered in the United States to qualified
institutional buyers as defined in Rule 144A under the U.S.
Securities Act of 1933, as amended (the "Securities Act"), and
outside the United States pursuant to Regulation S of the Securities
Act. The New Notes were offered to investors in Singapore pursuant to
exemptions invoked under Section 274 and Section 275 of the
Securities and Futures Act, Chapter 289 of Singapore. 
The New Notes will not be and have not been registered under the
Securities Act and may not be offered or sold in the United States
absent registration or an applicable exemption from registration
requirements. 
Forward-looking Statements  
Certain statements in this release, including statements regarding
the Company's expectations and intentions relating to the completion
of the Concurrent Offering and the Exchange Offer and the use of
proceeds from the Concurrent Offering, are forward-looking
statements. All forward-looking statements involve a number of risks
and uncertainties that could cause actual results to differ
materially from expectations. There can be no assurance that the
Concurrent Offering or the Exchange Offer will be completed. Factors
that could cause actual results to differ include risks and
uncertainties related to market conditions and satisfaction of
customary closing conditions related to the Exchange Offer and the
Concurrent Offering and other factors discussed in its reports filed
with the SGX-ST. You should not unduly rely on such statements. We do
not intend, and do not assume any obligation, to update any
forward-looking statements to reflect subsequent events or
circumstances. 
References to "$" are to the lawful currency of the United States of
America. 
About STATS ChipPAC Ltd.  
STATS ChipPAC Ltd. (SGX-ST Code: S24) is a leading service provider
of semiconductor packaging design, assembly, test and distribution
solutions in diverse end market applications including
communications, digital consumer and computing. With global
headquarters in Singapore, STATS ChipPAC has design, research and
development, manufacturing or customer support offices throughout
Asia, the United States and Europe. STATS ChipPAC is listed on the
SGX-ST. Further information is available at www.statschippac.com.
Information contained in this website does not constitute a part of
this release.  
Investor Relations Contact:
Tham Kah Locke
Vice President of Corporate Finance 
Tel: (65) 6824 7788
Fax: (65) 6720 7826
email: kahlocke.tham@statschippac.com 
Media Contact:
Lisa Lavin
Deputy Director of Marketing Communications
Tel: (208) 867-9859
email: lisa.lavin@statschippac.com 
 
 
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