Nordic Semiconductor and Japanese Partners Demonstrate Application Development-ready Bluetooth Low Energy Modules at MWC 2013 BARCELONA, Spain, Feb. 27, 2013 /CNW/ - Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces demonstrations of 'blank' Bluetooth low energy modules from Japanese suppliers on the company's booth (Hall 6, stand 6C70) at Mobile World Congress 2013. The modules, based on Nordic's award-winning nRF51822 multiprotocol System-on-Chip (SoC), boast fully-compliant Bluetooth low energy protocol software cleanly separated from a blank application stack area ready for rapid development of the customer's own code. The modules being demonstrated come from leading Japanese ODMs Braveridge Co. Ltd, Fujitsu Component Limited, and Hosiden Corporation. Braveridge is exhibiting the "BVMCN5101_BK", Fujitsu Component the "MBH7BLZ02-100057", and Hosiden the "HRM1017". Other manufacturers are expected to release similar modules during 2013. These vendors selected the nRF51822 SoC for the modules because of its ultra low power consumption and RF performance, but also because, uniquely, the RF protocol software is separated from the developer's own application code. This separation brings three advantages: first, the modules are supplied complete with Nordic's verified and qualified Bluetooth low energy stack; second, the clean boundary between application and protocol stack simplifies development, and third, the application code can be developed on the nRF51822 chip's integrated 32-bit ARM® Cortex™-M0 based processor. Because the modules from each supplier will be shipped as Bluetooth v4.0- and RF-approved, development project timescales are shortened and costs reduced. Code development is accelerated by removing the need to struggle with integration of application code as part of a vendor-imposed application development framework. In addition, the nRF51822-based modules' processor allows for flexible application customization using the highly popular and familiar ARM Cortex programming environment without recourse to an external processor and associated development kit. "The Bluetooth low energy protocol stack in the nRF51822-based modules from our Japanese partners will be shipped as tested and qualified so the developer can focus solely on the application code," explains Mitsuo Yamazaki, Nordic's Regional Sales Manager for Japan. "This is impossible with competing devices and makes it much easier for designers to develop Bluetooth Smart-powered applications for the lucrative market for 'appcessories' - an accessory wirelessly paired with an 'app' on a smartphone or tablet computer. This market is in its infancy, but is forecast to become huge." http://www.nordicsemi.com Steven Keeping, email:firstname.lastname@example.org, web:www.nordicsemi.com, +61-403-810827 SOURCE: Nordic Semiconductor To view this news release in HTML formatting, please use the following URL: http://www.newswire.ca/en/releases/archive/February2013/27/c8877.html CO: Nordic Semiconductor NI: CPR ELE ELE -0- Feb/27/2013 16:26 GMT
Nordic Semiconductor and Japanese Partners Demonstrate Application Development-ready Bluetooth Low Energy Modules at MWC 2013
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