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Interlink Electronics and UCSB Announce Win-Win Partnership

  Interlink Electronics and UCSB Announce Win-Win Partnership

Business Wire

CAMARILLO, Calif. -- February 27, 2013

Interlink Electronics, Inc. (OTC: LINK) announced today its affiliation with
UC Santa Barbara's Corporate Affiliates Program. Interlink's 28 years of
expertise in advanced sensor technologies for Human/Machine interface
applications and UCSB's portfolio of services such as research collaboration,
technology licensing, and state-of-the-art R&D facilities represent a win-win
partnership for advanced research and development initiatives.

Interlink Electronics, Inc. is the inventor of the Force Sensing Resistor®
(FSR®) technology and is a technology pioneer in the printed electronics
industry with over 30 patents issued or pending. FSR® devices are uniquely
suited for a variety of applications such as force sensing, position sensing,
and mouse & pointing applications, in a wide range of industries including
medical, industrial automation, automotive, ruggedized equipment, robotics,
and military systems.

Dr. Howard D. Goldberg, EVP of Corporate Business Development & Strategic
Partnerships, commented: "Interlink's team understands that collaborating with
the best engineers and scientists will accelerate innovation & technology
development. This will allow us to continue to be at the leading edge and
drive new business opportunities. Recognized as world leaders in materials
science and micro-fabrication technologies, UCSB offers some of the newest and
most comprehensively equipped R&D facilities in the world."

Mr. Steven N. Bronson, Interlink Electronics' Chief Executive Officer, said:
"To successfully compete in today's High-Tech markets, the notion of having to
do all R&D in-house is outdated thinking. The key to commercial success is
leveraging expertise through collaborative R&D relationships in order to
accelerate time-to-market and reduce R&D costs.” Mr. Bronson added, "Interlink
Electronics is proud to become a member of the Corporate Affiliates Program,
whose membership includes such High-Tech industry leaders as Teledyne,
Microsoft, Northrop Grumman, Corning, and Raytheon."

About Interlink Electronics, Inc.

Interlink Electronics, Inc. (OTC Markets: LINK) is a sensor technology company
and one of the world’s leading innovators of intuitive interface design. With
numerous patents around the world protecting its technologies and products,
Interlink Electronics serves a world-class customer base from its corporate
headquarters in Camarillo, California, and offices in Japan, Hong Kong and
China. For more information, see http://www.interlinkelectronics.com.

This release contains forward-looking statements that involve a number of
risks and uncertainties. The following are among the factors that could cause
actual results to differ materially from the forward-looking statements:
historical losses and negative cash flow, the success of business divestitures
and acquisitions, the ownership of the majority of our stock by a small group
of investors, our success in predicting new markets and the acceptance of our
new products, efficient management of our infrastructure, the pace of
technological developments and industry standards evolution and their effect
on our target product and market choices, the effect of outsourcing technology
development, changes in the ordering patterns of our customers, a decrease in
the quality and/or reliability of our products, protection of our proprietary
intellectual property, competition by alternative sophisticated as well as
generic products, pending litigation against Interlink, historical weaknesses
in internal controls over financial accounting, the continued availability at
competitive prices of raw materials for our products, disruptions in our
manufacturing facilities, risks of international sales and operations
including fluctuations in exchange rates, compliance with regulatory
requirements applicable to our manufacturing operations, and customer
concentrations. The forward-looking statements contained in this release
should be considered in light of these risk factors.

Contact:

Interlink Electronics, Inc.
For Investor Relations:
Steven N. Bronson, CEO
805-484-8855, ext. 112
sbronson@interlinkelectronics.com
or
For product information:
Paul Kelley, Global Sales Manager
805-436-0271
pkelley@interlinkelectronics.com
 
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