CEVA DSPs Continue to Lead the Way at Mobile World Congress

         CEVA DSPs Continue to Lead the Way at Mobile World Congress

Broad range of new CEVA-powered products, platforms and solutions unveiled by
CEVA customers, partners and OEMs

PR Newswire

BARCELONA, Spain, Feb. 26, 2013

BARCELONA, Spain, Feb. 26, 2013 /PRNewswire/ -- Mobile World Congress - CEVA,
Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property
(SIP) platform solutions and DSP cores, today announced that its customers,
partners and CEVA-powered OEMs have come out in full force at Mobile World
Congress 2013, debuting a wide range of new products, solutions and end-market
devices at the show. Leveraging on the ultra-low power and industry-leading
performance enabled by CEVA's DSPs and platforms, many of the more than fifty
CEVA customers, partners and OEMs participating at the Congress introduced new
products and solutions. Highlights include:

(Logo: http://photos.prnewswire.com/prnh/20120808/SF53702LOGO)

  oACER's Liquid C1 smartphone, powered by Intel and featuring a HSPA+ modem
  oAricent and Mindspeed introduced an integrated eNodeB solution based on
    the Transcede T3300 baseband processor supporting 20 MHz LTE FDD and
    throughputs of up to 150 Mbps
  oASUS' Fonepad, a 7 inch phablet powered by Intel and featuring a HSPA+
    modem
  oBroadcom demonstrated their 4G LTE modem capable of LTE Category 4
    download speeds of up to 150Mbps
  oDSP Group Introduced DBMD2 - The World's Most Powerful Voice Enhancement
    IC. DBMD2 is powered by the CEVA-TeakLite-III DSP
  oIntel unveiled their latest dual-core Clover Trail+ mobile Atom processor
    platform paired with XMM™ 6360 DC-HSPA+ modem
  oLenovo's K900 smartphone powered by Intel and featuring a HSPA+ modem
  oMindspeed introduced the T3400 and T4400 Transcede SoCs targeting
    LTE-Advanced metrocell class small cells and premium enterprise small
    cells
  oNokia announced the entry-level Nokia 105 phone, its lowest ever priced
    phone with a color screen
  oSamsung announced the launch of the 8 inch tablet, the GALAXY Note 8.0
    with HSPA+ modem.
  oSamsung also displayed a range of smartphones, tablets and other devices
    powered by CEVA DSPs, including the Galaxy Grand Duos, Galaxy Fame, and
    the Galaxy Camera all powered by CEVA DSPs
  oSIMcom launched their latest M2M modules, including the SIM928 module
    based on the ST-Ericsson PNX4851 platform
  oTelit announced the expansion of its mobile computing and M2M offerings,
    leveraging their collaboration with Intel

Technologies on display at CEVA's booth include:

  oAdvanced audio post-processing for mobile devices powered by the
    CEVA-TeakLite-III and CEVA-TeakLite-4 DSPs, including Dolby Mobile 3+, DTS
    TruMediaHD and Dirac HD Sound
  oAdvanced image and video enhancement features, including video stabilizer,
    video dynamic range compression and color enhancement powered by the
    CEVA-MM3101 imaging and vision platform
  oAntcor's 802.11ac Wi-Fi solution running on the CEVA-XC DSP
  oDSP Group's HDClear™ voice enhancement solution powered by the
    CEVA-TeakLite-III DSP
  oeyeSight's industry-leading gesture software running on the CEVA-MM3101
    imaging and vision platform in silicon
  oFace detection and recognition powered by the CEVA-MM3101 imaging and
    vision platform
  oGalileo Satellite Navigation's (GSN) GNSS solution running on the CEVA-XC
    DSP
  oNXP Software's LifeVibes™ VoiceExperience™ solution running on the
    CEVA-TeakLite-III DSP.
  oSensory's TrulyHandsfree™ always-on lowest-power voice activation
    technology running on the CEVA-TeakLite-III DSP

More information and video footage of the innovative technology demonstrations
on display at CEVA's booth can be found online at CEVA's Mobile World Congress
Virtual Booth – to view, visit http://events.ceva-dsp.com/mwc/

About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP)
DSP cores and platform solutions for the mobile, portable and consumer
electronics markets. CEVA's IP portfolio includes comprehensive technologies
for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD
audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA
(SATA). In 2012, CEVA's IP was shipped in more than 1 billion devices,
powering smartphones from many of the world's leading OEMs, including HTC,
Huawei, Lenovo, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more
than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For
more information, visit www.ceva-dsp.com. Follow CEVA on twitter at
www.twitter.com/cevadsp.

SOURCE CEVA, Inc.

Website: http://www.ceva-dsp.com
Contact: Richard Kingston, CEVA, Inc., +1-650-417-7976,
richard.kingston@ceva-dsp.com; or Mike Sottak, Wired Island, Ltd.,
+1-408-876-4418, mike@wiredislandpr.com
 
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