Qualcomm Snapdragon 800 Processor First to Use TSMC's 28HPM Advanced Process Technology

 Qualcomm Snapdragon 800 Processor First to Use TSMC's 28HPM Advanced Process
                                  Technology

Snapdragon 800 processor on 28nm HPM process delivers high performance and low
power for mobile devices

PR Newswire

SAN DIEGO and HSINCHU, Taiwan, R.O.C., Feb. 25, 2013

SAN DIEGOand HSINCHU, Taiwan, R.O.C., Feb. 25, 2013 /PRNewswire/ --Qualcomm
Incorporated (NASDAQ: QCOM) and TSMC (TWSE: 2330, NYSE: TSM) today announced
that Qualcomm's wholly owned subsidiary, Qualcomm Technologies, Inc., will be
the first company to produce working silicon on TSMC's 28nm HPM (High
Performance Mobile) process technology. TSMC's 28HPM is the first production
process that can support 2GHz + application processors with low power
consumption. The process is ideally suited for tablet and high-end smartphone
applications.

The first 28HPM production device is a Qualcomm Snapdragon™ 800 processor with
quad core Krait 400 CPUs with speeds of up to 2.3 GHz per core, customized for
low power consumption. It also is the first SoC to integrate a 4G LTE
Advanced modem with Carrier Aggregation and Category 4 data speeds up to 150
Mbps. Compared to previous generations, Qualcomm Technologies has
significantly improved overall power efficiency via reduced leakage and active
power while substantially increasing speed in its Qualcomm Snapdragon 800
processors.

With its large speed and power range, TSMC's 28HPM process is optimized for
mobile computing applications. It also supports wide market applications from
application processors, integrated application processors with multimode
LTE-Advanced Qualcomm Gobi modems to cloud-computing networking applications.
The process could support CPU speeds of 2-2.3GHz with less than 750mW of power
consumption per core. Compared to TSMC's 40LP, 28HPM devices are 2.5-2.7X
faster, and cut active power in half.

"By utilizing TSMC's 28HPM process, Qualcomm Snapdragon 800 processors will
deliver industry leading performance and outstanding battery life," said Jim
Lederer, executive vice president and general manager, Qualcomm Technologies.
"In working closely with TSMC, we maximize the impact this process will have
on bringing Qualcomm Snapdragon 800 processors to tablet and high-end
smartphone solutions, while continuing to find ways to align our business and
strategic objectives that help to define the value of our partnership."

"Qualcomm Technologies uses its world-class architecture and deep familiarity
with 28nm design to achieve breakthrough 2.3GHz performance and power
characteristics high-end smartphone users want today," said Rick Cassidy,
President, TSMC North America. "We are happy to see Qualcomm Technologies'
achievement in producing the first 28HPM device and congratulate them on their
ongoing mobile device leadership."

About Qualcomm Incorporated
Qualcomm Incorporated (NASDAQ: QCOM) is the world leader in 3G, 4G and
next-generation wireless technologies. Qualcomm Incorporated includes
Qualcomm's licensing business, QTL, and the vast majority of its patent
portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm
Incorporated, operates, along with its subsidiaries, substantially all of
Qualcomm's engineering, research and development functions, and substantially
all of its products and services businesses, including its semiconductor
business, QCT. For more than 25 years, Qualcomm ideas and inventions have
driven the evolution of digital communications, linking people everywhere more
closely to information, entertainment and each other. For more information,
visit Qualcomm's website, OnQ blog, Twitter and Facebook pages.

About TSMC
TSMC is the world's largest dedicated semiconductor foundry, providing the
industry's leading process technology and the foundry segment's largest
portfolio of process-proven libraries, IPs, design tools and reference flows.
The Company's managed capacity in 2012 totaled 15.1 million (8-inch
equivalent) wafers, including capacity from three advanced 12-inch GIGAFAB™
facilities, four eight-inch fabs, one six-inch fab, as well as TSMC's wholly
owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC.
TSMC is the first foundry to provide 28nm production capabilities. Its
corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC
please visit http://www.tsmc.com.

SOURCE TSMC

Website: http://www.tsmc.com
Contact: Qualcomm, Tina Asmar, Corporate Communications, +1-858-845-5959,
corpcomm@qualcomm.com; or Warren Kneeshaw, Investor Relations,
+1-858-658-4813, ir@qualcomm.com; or TSMC Spokesperson, Lora Ho, Senior VP &
CFO, 1-886-3-505-4602; or TSMC Acting Spokesperson, Elizabeth Sun, Director,
Corporate Communication Division, 1-886-3-568-2085, Mobile: 1-886-988-937999,
elizabeth_sun@tsmc.com; or Baker Li, Project Manager, PR Department,
1-886-3-563-6688, Ext. 7125037, Mobile: 1-886-988-932-757, baker_li@tsmc.com
 
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