DSP Group License CEVA Audio DSP for HDClear Voice Enhancement Solution

   DSP Group License CEVA Audio DSP for HDClear Voice Enhancement Solution

DSP Group's HDClear™ solution leverages high-performance, low-power
CEVA-TeakLite-III DSP to deliver a revolutionary noise cancellation technology
for mobile devices; Companies to showcase new SoC at Mobile World Congress

PR Newswire

MOUNTAIN VIEW, Calif., Feb. 25, 2013

MOUNTAIN VIEW, Calif., Feb. 25, 2013 /PRNewswire/ -- CEVA, Inc. (NASDAQ:
CEVA), the leading licensor of silicon intellectual property (SIP) platform
solutions and DSP cores, today announced that DSP Group® (NASDAQ: DSPG), a
leading global provider of wireless chipset solutions for converged
communications, has licensed and deployed the CEVA-TeakLite-III DSP in the
latest voice and audio SoC powering its innovative HDClear solution. The
high-performance, low-power DBMD2 SoC enables enhanced noise cancellation and
maximizes automatic speech recognition (ASR) accuracy in any environment,
isolating voice from surrounding environmental noise, enabling mobile users to
use their voice effectively anywhere. HDClearis designed to revolutionize the
voice user experience in mobile and other consumer electronic devices. The
HDClear solution and the DBMD2 SoC will be demonstrated at Mobile World
Congress in CEVA's booth (Stand 7i70).

(Logo: http://photos.prnewswire.com/prnh/20120808/SF53702LOGO)

The demand for improved battery life in mobile devices and reduced energy
consumption for consumer electronics dictates the need to offload complex and
power-hungry audio and voice processing from the main CPU onto a dedicated
low-power audio DSP. The DBMD2 SoC efficiently performs complex real-time
signal processing functions like noise reduction, beam-forming, voice
activation and virtual surround, in addition to addressing voice activation
recognition performance and quality issues in noisy environments. The
CEVA-TeakLite-III DSP at the core of the DBMD2 SoC easily handles all of these
complex tasks, while leaving ample headroom on the DSP for customers and OEMs
to further differentiate their product designs by adding proprietary or third
party algorithms.

"The CEVA-TeakLite-III DSP provides the perfect balance of ultra-low power and
exceptional audio/voice processing for our DBMD2 SoC at the heart of the
HDClear solution," said Dr. Arie Heiman, Corporate Vice President and General
Manager of HDMobile at DSP Group. "The maturity and robustness of the complete
CEVA package, from the DSP implementation through to the CEVA Toolbox™
software development environment and hardware development kit helped us in
reaching our demanding goals."

Eran Briman, vice president of marketing at CEVA, commented: "We are pleased
to see the quick design turnaround time DSP Group has been able to achieve,
with the DBMD2 SoC already available in silicon. The capabilities of their
latest HDClear product offering are impressive and firmly position DSP Group
on the leading edge of the market for advanced, low power audio/voice
platforms. By using the programmable CEVA-TeakLite-III DSP as a foundation,
DSP Group enables their customers to differentiate their products via software
add-ons and updates, allowing them to evolve and adapt to new market

About the CEVA TeakLite family

The CEVA-TeakLite-III is a member of the CEVA-TeakLite DSP family, the most
successful licensable DSP family in the history of the semiconductor industry,
with more than 2.5 billion chips shipped, over 100 licensees, 30 active
ecosystem partners and more than 100 audio and voice codecs and enrichment
applications available. It is widely deployed in home entertainment SoCs,
mobile application processors and audio CODEC chips, handling advanced audio
and voice scenarios. To learn more about the CEVA-TeakLite DSP family, visit

About DSP Group

DSP Group®, Inc. (NASDAQ: DSPG) is a leading global provider of wireless
chipset solutions for converged communications. Delivering semiconductor
system solutions with software and reference designs, DSP Group enables
OEMs/ODMs, consumer electronics (CE) manufacturers and service providers to
cost-effectively develop new revenue-generating products with fast time to
market. At the forefront of semiconductor innovation and operational
excellence for over two decades, DSP Group provides a broad portfolio of
wireless chipsets integrating DECT/CAT-iq, DECT ULE, Wi-Fi, PSTN, HDClear™,
video and VoIP technologies. DSP Group enables converged voice, audio, video
and data connectivity across diverse mobile, consumer and enterprise products
– from mobile devices, connected multimedia screens, and home automation &
security to cordless phones, VoIP systems, and home gateways. Leveraging
industry-leading experience and expertise, DSP Group partners with CE
manufacturers and service providers to shape the future of converged
communications at home, office and on the go. For more information, visit

About CEVA, Inc.

CEVA is the world's leading licensor of silicon intellectual property (SIP)
DSP cores and platform solutions for the mobile, portable and consumer
electronics markets. CEVA's IP portfolio includes comprehensive technologies
for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD
audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA
(SATA). In 2012, CEVA's IP was shipped in more than 1 billion devices,
powering smartphones from many of the world's leading OEMs, including HTC,
Huawei, Lenovo, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more
than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For
more information, visit www.ceva-dsp.com. Follow CEVA on twitter at


Website: http://www.ceva-dsp.com
Website: http://www.dspg.com
Contact: Richard Kingston, CEVA, Inc., +1-650-417-7976,
richard.kingston@ceva-dsp.com; Mike Sottak, Wired Island, Ltd.,
+1-408-876-4418, mike@wiredislandpr.com
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